IRF7329TRPBF
- Mfr.Part #
- IRF7329TRPBF
- Manufacturer
- Infineon Technologies
- Package / Case
- 8-SOIC (0.154, 3.90mm Width)
- Datasheet
- Download
- Description
- MOSFET 2P-CH 12V 9.2A 8-SOIC
- Stock
- 6,380
- In Stock :
- 6,380
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Arrays
- Width :
- 3.9878mm
- Mounting Type :
- Surface Mount
- Vgs(th) (Max) @ Id :
- 900mV @ 250μA
- Series :
- HEXFET®
- Input Capacitance (Ciss) (Max) @ Vds :
- 3450pF @ 10V
- Turn On Delay Time :
- 10 ns
- Package / Case :
- 8-SOIC (0.154, 3.90mm Width)
- Number of Elements :
- 2
- Radiation Hardening :
- No
- RoHS Status :
- ROHS3 Compliant
- FET Type :
- 2 P-Channel (Dual)
- Number of Terminations :
- 8
- Transistor Application :
- SWITCHING
- Operating Temperature :
- -55°C~150°C TJ
- Continuous Drain Current (ID) :
- 9.2A
- Packaging :
- Tape and Reel (TR)
- Power Dissipation :
- 2W
- Factory Lead Time :
- 12 Weeks
- Current Rating :
- -9.2A
- Terminal Form :
- Gull wing
- Drain to Source Voltage (Vdss) :
- 12V
- Base Part Number :
- IRF7329PBF
- Gate Charge (Qg) (Max) @ Vgs :
- 57nC @ 4.5V
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Max Power Dissipation :
- 2W
- Length :
- 4.9784mm
- Turn-Off Delay Time :
- 340 ns
- Lead Free :
- Lead Free
- Operating Mode :
- ENHANCEMENT MODE
- Rise Time :
- 8.6ns
- Transistor Element Material :
- SILICON
- Number of Pins :
- 8
- FET Feature :
- Logic Level Gate
- FET Technology :
- METAL-OXIDE SEMICONDUCTOR
- Mount :
- Surface Mount
- Fall Time (Typ) :
- 260 ns
- Drain to Source Breakdown Voltage :
- -12V
- Rds On (Max) @ Id, Vgs :
- 17m Ω @ 9.2A, 4.5V
- Height :
- 1.4986mm
- Voltage - Rated DC :
- -12V
- Published :
- 2004
- Drain-source On Resistance-Max :
- 0.017Ohm
- Element Configuration :
- Dual
- Gate to Source Voltage (Vgs) :
- 8V
- Datasheets
- IRF7329TRPBF

IRF7329TRPBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available at
IRF7329TRPBF Description
Intrative Rectifier's new P-channel HEXFET power MOSFET uses advanced technology to achieve extremely low on-resistance per silicon area. This advantage, combined with the well-known rugged device design of HEXFET Power MOSFET, provides designers with an extremely efficient and reliable device for use in a variety of applications. Over the years, SO-8 has been improved through customized thermal characteristics and multi-chip capabilities, making it an ideal choice for a variety of power applications.With these improvements multiple devices that can be used to greatly reduce circuit board space. The package is designed for gas phase, infrared or wave soldering technology.
IRF7329TRPBF Features
Trench Technology
Ultra Low On-Resistance
Dual P-Channel MOSFET
Low Profile (<1.8mm)
Available in Tape & Reel
Lead-Free
IRF7329TRPBF Applications
making it an ideal choice for a variety of power applications
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