IRF7329TRPBF
- Mfr.Part #
- IRF7329TRPBF
- Manufacturer
- Infineon Technologies
- Package / Case
- 8-SOIC (0.154, 3.90mm Width)
- Datasheet
- Download
- Description
- MOSFET 2P-CH 12V 9.2A 8-SOIC
- Stock
- 6,380
- In Stock :
- 6,380
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Arrays
- Number of Terminations :
- 8
- Gate Charge (Qg) (Max) @ Vgs :
- 57nC @ 4.5V
- Current Rating :
- -9.2A
- Turn-Off Delay Time :
- 340 ns
- Terminal Form :
- Gull wing
- Rds On (Max) @ Id, Vgs :
- 17m Ω @ 9.2A, 4.5V
- Package / Case :
- 8-SOIC (0.154, 3.90mm Width)
- Fall Time (Typ) :
- 260 ns
- Continuous Drain Current (ID) :
- 9.2A
- Power Dissipation :
- 2W
- FET Feature :
- Logic Level Gate
- Published :
- 2004
- Gate to Source Voltage (Vgs) :
- 8V
- Drain to Source Breakdown Voltage :
- -12V
- Height :
- 1.4986mm
- Transistor Application :
- SWITCHING
- Max Power Dissipation :
- 2W
- Operating Mode :
- ENHANCEMENT MODE
- Base Part Number :
- IRF7329PBF
- Rise Time :
- 8.6ns
- Drain to Source Voltage (Vdss) :
- 12V
- Mount :
- Surface Mount
- Vgs(th) (Max) @ Id :
- 900mV @ 250μA
- Mounting Type :
- Surface Mount
- FET Technology :
- METAL-OXIDE SEMICONDUCTOR
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Turn On Delay Time :
- 10 ns
- Width :
- 3.9878mm
- FET Type :
- 2 P-Channel (Dual)
- Packaging :
- Tape and Reel (TR)
- Length :
- 4.9784mm
- Operating Temperature :
- -55°C~150°C TJ
- RoHS Status :
- ROHS3 Compliant
- Transistor Element Material :
- SILICON
- Factory Lead Time :
- 12 Weeks
- Series :
- HEXFET®
- Drain-source On Resistance-Max :
- 0.017Ohm
- Number of Elements :
- 2
- Input Capacitance (Ciss) (Max) @ Vds :
- 3450pF @ 10V
- Radiation Hardening :
- No
- Element Configuration :
- Dual
- Number of Pins :
- 8
- Lead Free :
- Lead Free
- Voltage - Rated DC :
- -12V
- Datasheets
- IRF7329TRPBF

IRF7329TRPBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available at
IRF7329TRPBF Description
Intrative Rectifier's new P-channel HEXFET power MOSFET uses advanced technology to achieve extremely low on-resistance per silicon area. This advantage, combined with the well-known rugged device design of HEXFET Power MOSFET, provides designers with an extremely efficient and reliable device for use in a variety of applications. Over the years, SO-8 has been improved through customized thermal characteristics and multi-chip capabilities, making it an ideal choice for a variety of power applications.With these improvements multiple devices that can be used to greatly reduce circuit board space. The package is designed for gas phase, infrared or wave soldering technology.
IRF7329TRPBF Features
Trench Technology
Ultra Low On-Resistance
Dual P-Channel MOSFET
Low Profile (<1.8mm)
Available in Tape & Reel
Lead-Free
IRF7329TRPBF Applications
making it an ideal choice for a variety of power applications
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