BSM300D12P2E001

Manufacturer :

ROHM Semiconductor

Product Category :

Transistors - FETs, MOSFETs - Arrays

Operating Temperature :

-40°C~150°C TJ

Terminal Position :

UPPER

FET Type :

2 N-Channel (Half Bridge)

Factory Lead Time :

25 Weeks

Configuration :

SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR

Drain to Source Voltage (Vdss) :

1200V 1.2kV

Number of Terminations :

11

Published :

2015

Mounting Type :

Chassis Mount

Terminal Form :

UNSPECIFIED

FET Feature :

Silicon Carbide (SiC)

FET Technology :

METAL-OXIDE SEMICONDUCTOR

Reach Compliance Code :

not_compliant

Transistor Application :

SWITCHING

Packaging :

Tray

Time@Peak Reflow Temperature-Max (s) :

NOT SPECIFIED

RoHS Status :

ROHS3 Compliant

Current - Continuous Drain (Id) @ 25°C :

300A Tc

Vgs(th) (Max) @ Id :

4V @ 68mA

Case Connection :

Isolated

JESD-30 Code :

R-XUFM-X11

Package / Case :

Module

Max Power Dissipation :

1.875kW

ECCN Code :

EAR99

Continuous Drain Current (ID) :

300A

Mount :

Surface Mount

Pulsed Drain Current-Max (IDM) :

600A

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

DS Breakdown Voltage-Min :

1200V

Input Capacitance (Ciss) (Max) @ Vds :

35000pF @ 10V

Number of Elements :

2

Power - Max :

1875W

Operating Mode :

ENHANCEMENT MODE

Peak Reflow Temperature (Cel) :

NOT SPECIFIED