BSM300D12P2E001
- Mfr.Part #
- BSM300D12P2E001
- Manufacturer
- ROHM Semiconductor
- Package / Case
- Module
- Datasheet
- Download
- Description
- MOSFET 2N-CH 1200V 300A
- Stock
- 3
- In Stock :
- 3
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- Manufacturer :
- ROHM Semiconductor
- Product Category :
- Transistors - FETs, MOSFETs - Arrays
- Current - Continuous Drain (Id) @ 25°C :
- 300A Tc
- Transistor Application :
- SWITCHING
- Operating Temperature :
- -40°C~150°C TJ
- RoHS Status :
- ROHS3 Compliant
- Vgs(th) (Max) @ Id :
- 4V @ 68mA
- Packaging :
- Tray
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Max Power Dissipation :
- 1.875kW
- Drain to Source Voltage (Vdss) :
- 1200V 1.2kV
- JESD-30 Code :
- R-XUFM-X11
- FET Feature :
- Silicon Carbide (SiC)
- Mount :
- Surface Mount
- Terminal Position :
- UPPER
- Pulsed Drain Current-Max (IDM) :
- 600A
- Published :
- 2015
- Mounting Type :
- Chassis Mount
- Reach Compliance Code :
- not_compliant
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Continuous Drain Current (ID) :
- 300A
- Package / Case :
- Module
- Input Capacitance (Ciss) (Max) @ Vds :
- 35000pF @ 10V
- Operating Mode :
- ENHANCEMENT MODE
- Terminal Form :
- UNSPECIFIED
- Factory Lead Time :
- 25 Weeks
- Number of Terminations :
- 11
- FET Technology :
- METAL-OXIDE SEMICONDUCTOR
- DS Breakdown Voltage-Min :
- 1200V
- ECCN Code :
- EAR99
- Number of Elements :
- 2
- Case Connection :
- Isolated
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- FET Type :
- 2 N-Channel (Half Bridge)
- Configuration :
- SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR
- Power - Max :
- 1875W
- Datasheets
- BSM300D12P2E001

BSM300D12P2E001 datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from ROHM Semiconductor stock available at
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