IRF7304
- Mfr.Part #
- IRF7304
- Manufacturer
- Infineon Technologies
- Package / Case
- 8-SOIC (0.154, 3.90mm Width)
- Datasheet
- Download
- Description
- MOSFET 2P-CH 20V 4.3A 8-SOIC
- Stock
- 192
- In Stock :
- 192
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Arrays
- Gate Charge (Qg) (Max) @ Vgs :
- 22nC @ 4.5V
- Input Capacitance (Ciss) (Max) @ Vds :
- 610pF @ 15V
- Configuration :
- SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
- Packaging :
- Tube
- Series :
- HEXFET®
- Number of Elements :
- 2
- Power - Max :
- 2W
- Surface Mount :
- yes
- Current - Continuous Drain (Id) @ 25°C :
- 4.3A
- Transistor Element Material :
- SILICON
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Mounting Type :
- Surface Mount
- Published :
- 1997
- Terminal Form :
- Gull wing
- Peak Reflow Temperature (Cel) :
- 245
- DS Breakdown Voltage-Min :
- 20V
- Additional Feature :
- LOGIC LEVEL COMPATIBLE
- Qualification Status :
- Not Qualified
- JESD-30 Code :
- R-PDSO-G8
- JESD-609 Code :
- e0
- Drain to Source Voltage (Vdss) :
- 20V
- FET Technology :
- METAL-OXIDE SEMICONDUCTOR
- Drain-source On Resistance-Max :
- 0.09Ohm
- FET Type :
- 2 P-Channel (Dual)
- Time@Peak Reflow Temperature-Max (s) :
- 30
- ECCN Code :
- EAR99
- RoHS Status :
- Non-RoHS Compliant
- Vgs(th) (Max) @ Id :
- 700mV @ 250μA
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Number of Terminations :
- 8
- HTS Code :
- 8541.29.00.95
- Rds On (Max) @ Id, Vgs :
- 90m Ω @ 2.2A, 4.5V
- Drain Current-Max (Abs) (ID) :
- 3.6A
- Operating Temperature :
- -55°C~150°C TJ
- Package / Case :
- 8-SOIC (0.154, 3.90mm Width)
- FET Feature :
- Logic Level Gate
- Operating Mode :
- ENHANCEMENT MODE
- Datasheets
- IRF7304

IRF7304 datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available at
IRF7304 Description
The fifth generation HEXFET of International Rectifier Company uses advanced technology to achieve minimum on-resistance, combines the well-known fast switching speed and rugged device design of HEXFET power MOSFET, and provides designers with an extremely efficient device used in a variety of applications.
The SO-8 has been improved by customizing lead frames to enhance thermal properties and a variety of capabilities to handle a variety of power applications. With these improvements, multiple devices can be used in one application while reducing circuit board space. The package is designed for vapor phase infrared. Or wave soldering technology in typical printed circuit board placement applications, power consumption of more than 0.8W is possible.
IRF7304 Features
Generation V Technology
Ultra Low On-Resistance
Dual P-Channel Mosfet Surface Mount
Available in Tape&Reel
Dynamic dv/dt Rating
Fast Switching
IRF7304 Applications
provides designers with an extremely efficient device used in a variety of applications.
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