IRF7304
- Mfr.Part #
- IRF7304
- Manufacturer
- Infineon Technologies
- Package / Case
- 8-SOIC (0.154, 3.90mm Width)
- Datasheet
- Download
- Description
- MOSFET 2P-CH 20V 4.3A 8-SOIC
- Stock
- 192
- In Stock :
- 192
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Arrays
- HTS Code :
- 8541.29.00.95
- Packaging :
- Tube
- Configuration :
- SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
- Operating Mode :
- ENHANCEMENT MODE
- Drain Current-Max (Abs) (ID) :
- 3.6A
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Series :
- HEXFET®
- JESD-609 Code :
- e0
- Input Capacitance (Ciss) (Max) @ Vds :
- 610pF @ 15V
- Published :
- 1997
- Mounting Type :
- Surface Mount
- ECCN Code :
- EAR99
- Qualification Status :
- Not Qualified
- Power - Max :
- 2W
- Transistor Element Material :
- SILICON
- DS Breakdown Voltage-Min :
- 20V
- Surface Mount :
- yes
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Terminal Form :
- Gull wing
- Peak Reflow Temperature (Cel) :
- 245
- Number of Elements :
- 2
- Current - Continuous Drain (Id) @ 25°C :
- 4.3A
- Package / Case :
- 8-SOIC (0.154, 3.90mm Width)
- Number of Terminations :
- 8
- FET Technology :
- METAL-OXIDE SEMICONDUCTOR
- Vgs(th) (Max) @ Id :
- 700mV @ 250μA
- Operating Temperature :
- -55°C~150°C TJ
- JESD-30 Code :
- R-PDSO-G8
- Drain to Source Voltage (Vdss) :
- 20V
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Gate Charge (Qg) (Max) @ Vgs :
- 22nC @ 4.5V
- Rds On (Max) @ Id, Vgs :
- 90m Ω @ 2.2A, 4.5V
- Drain-source On Resistance-Max :
- 0.09Ohm
- FET Type :
- 2 P-Channel (Dual)
- FET Feature :
- Logic Level Gate
- RoHS Status :
- Non-RoHS Compliant
- Additional Feature :
- LOGIC LEVEL COMPATIBLE
- Datasheets
- IRF7304

IRF7304 datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available at
IRF7304 Description
The fifth generation HEXFET of International Rectifier Company uses advanced technology to achieve minimum on-resistance, combines the well-known fast switching speed and rugged device design of HEXFET power MOSFET, and provides designers with an extremely efficient device used in a variety of applications.
The SO-8 has been improved by customizing lead frames to enhance thermal properties and a variety of capabilities to handle a variety of power applications. With these improvements, multiple devices can be used in one application while reducing circuit board space. The package is designed for vapor phase infrared. Or wave soldering technology in typical printed circuit board placement applications, power consumption of more than 0.8W is possible.
IRF7304 Features
Generation V Technology
Ultra Low On-Resistance
Dual P-Channel Mosfet Surface Mount
Available in Tape&Reel
Dynamic dv/dt Rating
Fast Switching
IRF7304 Applications
provides designers with an extremely efficient device used in a variety of applications.
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