IRF7304
- Mfr.Part #
- IRF7304
- Manufacturer
- Infineon Technologies
- Package / Case
- 8-SOIC (0.154, 3.90mm Width)
- Datasheet
- Download
- Description
- MOSFET 2P-CH 20V 4.3A 8-SOIC
- Stock
- 192
- In Stock :
- 192
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Arrays
- Surface Mount :
- yes
- JESD-609 Code :
- e0
- JESD-30 Code :
- R-PDSO-G8
- Power - Max :
- 2W
- Packaging :
- Tube
- Peak Reflow Temperature (Cel) :
- 245
- Configuration :
- SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
- Operating Temperature :
- -55°C~150°C TJ
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Package / Case :
- 8-SOIC (0.154, 3.90mm Width)
- FET Type :
- 2 P-Channel (Dual)
- Series :
- HEXFET®
- Vgs(th) (Max) @ Id :
- 700mV @ 250μA
- Current - Continuous Drain (Id) @ 25°C :
- 4.3A
- Input Capacitance (Ciss) (Max) @ Vds :
- 610pF @ 15V
- Mounting Type :
- Surface Mount
- Drain to Source Voltage (Vdss) :
- 20V
- Additional Feature :
- LOGIC LEVEL COMPATIBLE
- Transistor Element Material :
- SILICON
- HTS Code :
- 8541.29.00.95
- Gate Charge (Qg) (Max) @ Vgs :
- 22nC @ 4.5V
- Qualification Status :
- Not Qualified
- Terminal Form :
- Gull wing
- ECCN Code :
- EAR99
- Operating Mode :
- ENHANCEMENT MODE
- RoHS Status :
- Non-RoHS Compliant
- Drain-source On Resistance-Max :
- 0.09Ohm
- DS Breakdown Voltage-Min :
- 20V
- Number of Elements :
- 2
- Published :
- 1997
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- FET Technology :
- METAL-OXIDE SEMICONDUCTOR
- Drain Current-Max (Abs) (ID) :
- 3.6A
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- FET Feature :
- Logic Level Gate
- Number of Terminations :
- 8
- Rds On (Max) @ Id, Vgs :
- 90m Ω @ 2.2A, 4.5V
- Datasheets
- IRF7304

IRF7304 datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available at
IRF7304 Description
The fifth generation HEXFET of International Rectifier Company uses advanced technology to achieve minimum on-resistance, combines the well-known fast switching speed and rugged device design of HEXFET power MOSFET, and provides designers with an extremely efficient device used in a variety of applications.
The SO-8 has been improved by customizing lead frames to enhance thermal properties and a variety of capabilities to handle a variety of power applications. With these improvements, multiple devices can be used in one application while reducing circuit board space. The package is designed for vapor phase infrared. Or wave soldering technology in typical printed circuit board placement applications, power consumption of more than 0.8W is possible.
IRF7304 Features
Generation V Technology
Ultra Low On-Resistance
Dual P-Channel Mosfet Surface Mount
Available in Tape&Reel
Dynamic dv/dt Rating
Fast Switching
IRF7304 Applications
provides designers with an extremely efficient device used in a variety of applications.
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