IRF7304
- Mfr.Part #
- IRF7304
- Manufacturer
- Infineon Technologies
- Package / Case
- 8-SOIC (0.154, 3.90mm Width)
- Datasheet
- Download
- Description
- MOSFET 2P-CH 20V 4.3A 8-SOIC
- Stock
- 192
- In Stock :
- 192
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Arrays
- Terminal Form :
- Gull wing
- Gate Charge (Qg) (Max) @ Vgs :
- 22nC @ 4.5V
- Series :
- HEXFET®
- Operating Mode :
- ENHANCEMENT MODE
- Drain Current-Max (Abs) (ID) :
- 3.6A
- JESD-30 Code :
- R-PDSO-G8
- Qualification Status :
- Not Qualified
- Additional Feature :
- LOGIC LEVEL COMPATIBLE
- Surface Mount :
- yes
- Time@Peak Reflow Temperature-Max (s) :
- 30
- ECCN Code :
- EAR99
- Mounting Type :
- Surface Mount
- FET Type :
- 2 P-Channel (Dual)
- FET Technology :
- METAL-OXIDE SEMICONDUCTOR
- Rds On (Max) @ Id, Vgs :
- 90m Ω @ 2.2A, 4.5V
- Current - Continuous Drain (Id) @ 25°C :
- 4.3A
- Configuration :
- SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
- Power - Max :
- 2W
- Drain-source On Resistance-Max :
- 0.09Ohm
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Input Capacitance (Ciss) (Max) @ Vds :
- 610pF @ 15V
- Vgs(th) (Max) @ Id :
- 700mV @ 250μA
- Operating Temperature :
- -55°C~150°C TJ
- RoHS Status :
- Non-RoHS Compliant
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- HTS Code :
- 8541.29.00.95
- Peak Reflow Temperature (Cel) :
- 245
- FET Feature :
- Logic Level Gate
- DS Breakdown Voltage-Min :
- 20V
- Number of Elements :
- 2
- Package / Case :
- 8-SOIC (0.154, 3.90mm Width)
- Published :
- 1997
- Transistor Element Material :
- SILICON
- Number of Terminations :
- 8
- JESD-609 Code :
- e0
- Packaging :
- Tube
- Drain to Source Voltage (Vdss) :
- 20V
- Datasheets
- IRF7304

IRF7304 datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available at
IRF7304 Description
The fifth generation HEXFET of International Rectifier Company uses advanced technology to achieve minimum on-resistance, combines the well-known fast switching speed and rugged device design of HEXFET power MOSFET, and provides designers with an extremely efficient device used in a variety of applications.
The SO-8 has been improved by customizing lead frames to enhance thermal properties and a variety of capabilities to handle a variety of power applications. With these improvements, multiple devices can be used in one application while reducing circuit board space. The package is designed for vapor phase infrared. Or wave soldering technology in typical printed circuit board placement applications, power consumption of more than 0.8W is possible.
IRF7304 Features
Generation V Technology
Ultra Low On-Resistance
Dual P-Channel Mosfet Surface Mount
Available in Tape&Reel
Dynamic dv/dt Rating
Fast Switching
IRF7304 Applications
provides designers with an extremely efficient device used in a variety of applications.
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