SI3900DV-T1-E3

Manufacturer :

Vishay

Product Category :

Transistors - FETs, MOSFETs - Arrays

Height :

1mm

JESD-609 Code :

e3

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Factory Lead Time :

14 Weeks

Element Configuration :

Dual

FET Technology :

METAL-OXIDE SEMICONDUCTOR

Drain to Source Breakdown Voltage :

20V

Number of Terminations :

6

Number of Pins :

6

Threshold Voltage :

600mV

Terminal Finish :

MATTE TIN

Gate to Source Voltage (Vgs) :

12V

Package / Case :

SOT-23-6 Thin, TSOT-23-6

Mount :

Surface Mount

Resistance :

125mOhm

ECCN Code :

EAR99

Weight :

19.986414mg

Max Power Dissipation :

830mW

FET Feature :

Logic Level Gate

Vgs(th) (Max) @ Id :

1.5V @ 250µA

Peak Reflow Temperature (Cel) :

260

Radiation Hardening :

No

Operating Mode :

ENHANCEMENT MODE

Transistor Element Material :

SILICON

Pin Count :

6

Gate Charge (Qg) (Max) @ Vgs :

4nC @ 4.5V

Drain Current-Max (Abs) (ID) :

2A

Operating Temperature :

-55°C~150°C TJ

Rds On (Max) @ Id, Vgs :

125m Ω @ 2.4A, 4.5V

Turn On Delay Time :

10 ns

Published :

2007

RoHS Status :

ROHS3 Compliant

Power Dissipation :

830mW

Number of Elements :

2

Series :

TrenchFET®

Lead Free :

Lead Free

Packaging :

Tape and Reel (TR)

Terminal Form :

Gull wing

Fall Time (Typ) :

30 ns

Drain to Source Voltage (Vdss) :

20V

Width :

1.65mm

Base Part Number :

SI3900

Nominal Vgs :

600 mV

Turn-Off Delay Time :

14 ns

Length :

3.05mm

Continuous Drain Current (ID) :

2A

Rise Time :

30ns

Mounting Type :

Surface Mount

Number of Channels :

2

REACH SVHC :

Unknown

FET Type :

2 N-Channel (Dual)

Time@Peak Reflow Temperature-Max (s) :

40