SI3900DV-T1-E3

Manufacturer :

Vishay

Product Category :

Transistors - FETs, MOSFETs - Arrays

Turn-Off Delay Time :

14 ns

Number of Elements :

2

Nominal Vgs :

600 mV

Lead Free :

Lead Free

JESD-609 Code :

e3

Terminal Form :

Gull wing

REACH SVHC :

Unknown

FET Type :

2 N-Channel (Dual)

FET Feature :

Logic Level Gate

Factory Lead Time :

14 Weeks

Fall Time (Typ) :

30 ns

Gate Charge (Qg) (Max) @ Vgs :

4nC @ 4.5V

Weight :

19.986414mg

Max Power Dissipation :

830mW

Package / Case :

SOT-23-6 Thin, TSOT-23-6

Threshold Voltage :

600mV

Length :

3.05mm

Transistor Element Material :

SILICON

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Vgs(th) (Max) @ Id :

1.5V @ 250µA

ECCN Code :

EAR99

Rds On (Max) @ Id, Vgs :

125m Ω @ 2.4A, 4.5V

Number of Channels :

2

Width :

1.65mm

Peak Reflow Temperature (Cel) :

260

Published :

2007

Operating Mode :

ENHANCEMENT MODE

Time@Peak Reflow Temperature-Max (s) :

40

RoHS Status :

ROHS3 Compliant

Packaging :

Tape and Reel (TR)

Drain to Source Breakdown Voltage :

20V

Number of Pins :

6

Height :

1mm

Gate to Source Voltage (Vgs) :

12V

Base Part Number :

SI3900

Drain Current-Max (Abs) (ID) :

2A

Terminal Finish :

MATTE TIN

Pin Count :

6

Drain to Source Voltage (Vdss) :

20V

Rise Time :

30ns

Resistance :

125mOhm

Continuous Drain Current (ID) :

2A

Number of Terminations :

6

Mounting Type :

Surface Mount

Turn On Delay Time :

10 ns

Element Configuration :

Dual

Radiation Hardening :

No

Operating Temperature :

-55°C~150°C TJ

Series :

TrenchFET®

FET Technology :

METAL-OXIDE SEMICONDUCTOR

Power Dissipation :

830mW

Mount :

Surface Mount