IRF7907PBF
- Mfr.Part #
- IRF7907PBF
- Manufacturer
- Infineon Technologies
- Package / Case
- 8-SOIC (0.154, 3.90mm Width)
- Datasheet
- Download
- Description
- MOSFET 2N-CH 30V 9.1A/11A 8SOIC
- Stock
- 5,185
- In Stock :
- 5,185
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Arrays
- Series :
- HEXFET®
- Power - Max :
- 2W
- Configuration :
- SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
- Avalanche Energy Rating (Eas) :
- 15 mJ
- JESD-609 Code :
- e3
- Mounting Type :
- Surface Mount
- DS Breakdown Voltage-Min :
- 30V
- Qualification Status :
- Not Qualified
- Number of Terminations :
- 8
- Vgs(th) (Max) @ Id :
- 2.35V @ 25µA
- FET Type :
- 2 N-Channel (Dual)
- RoHS Status :
- ROHS3 Compliant
- Package / Case :
- 8-SOIC (0.154, 3.90mm Width)
- Peak Reflow Temperature (Cel) :
- 260
- Drain to Source Voltage (Vdss) :
- 30V
- Input Capacitance (Ciss) (Max) @ Vds :
- 850pF @ 15V
- Operating Temperature :
- -55°C~150°C TJ
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Operating Mode :
- ENHANCEMENT MODE
- Time@Peak Reflow Temperature-Max (s) :
- 30
- FET Feature :
- Logic Level Gate
- Current - Continuous Drain (Id) @ 25°C :
- 9.1A 11A
- Transistor Element Material :
- SILICON
- Factory Lead Time :
- 10 Weeks
- Terminal Form :
- Gull wing
- Drain Current-Max (Abs) (ID) :
- 11A
- Drain-source On Resistance-Max :
- 0.0118Ohm
- Number of Elements :
- 2
- Terminal Finish :
- Matte Tin (Sn)
- ECCN Code :
- EAR99
- Published :
- 2006
- Rds On (Max) @ Id, Vgs :
- 16.4m Ω @ 9.1A, 10V
- Packaging :
- Tube
- FET Technology :
- METAL-OXIDE SEMICONDUCTOR
- Surface Mount :
- yes
- Pulsed Drain Current-Max (IDM) :
- 85A
- JESD-30 Code :
- R-PDSO-G8
- Base Part Number :
- IRF7907PBF
- Gate Charge (Qg) (Max) @ Vgs :
- 10nC @ 4.5V
- Power Dissipation-Max (Abs) :
- 2W
- Datasheets
- IRF7907PBF

IRF7907PBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available at
IRF7907PBF Description
The IRF7907PBF combines cutting-edge DirectFETTM packaging and contemporary HEXFET? Power MOSFET Silicon technology. When application note AN-1035 defining the manufacturing procedures and methods is followed, the DirectFET package is compatible with the layout geometries currently used in power applications, PCB assembly equipment, and vapor phase, infrared, or convection soldering techniques. In comparison to the previous-best, the DirectFET package's two-sided cooling increases heat transport in power systems while reducing thermal resistance by 80%.
IRF7907PBF Features
-
RDS(on) is Very Low at 4.5V VGS.
-
Small Gate Fee
-
Voltage and Current Characterized Avalanche in Full
-
Max. Gate Rating for 20V VGS
-
improved reverse recovery of the body diode
-
Completely tested for RG
-
Lead-Free
IRF7907PBF Applications
-
For POL, two SO-8 MOSFETs
-
Converters for servers, notebook computers, and
-
Game consoles, graphics cards, and set-top boxes
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