IRF3315S
- Mfr.Part #
- IRF3315S
- Manufacturer
- Infineon Technologies
- Package / Case
- TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
- Datasheet
- Download
- Description
- MOSFET N-CH 150V 21A D2PAK
- Stock
- 39,784
- In Stock :
- 39,784
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Single
- Gate Charge (Qg) (Max) @ Vgs :
- 95nC @ 10V
- JESD-30 Code :
- R-PSSO-G2
- Drain-source On Resistance-Max :
- 0.082Ohm
- Packaging :
- Tube
- JESD-609 Code :
- e0
- Transistor Element Material :
- SILICON
- Rds On (Max) @ Id, Vgs :
- 82m Ω @ 12A, 10V
- Qualification Status :
- Not Qualified
- ECCN Code :
- EAR99
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Terminal Form :
- Gull wing
- Operating Mode :
- ENHANCEMENT MODE
- Mounting Type :
- Surface Mount
- Published :
- 1997
- Number of Elements :
- 1
- Avalanche Energy Rating (Eas) :
- 350 mJ
- HTS Code :
- 8541.29.00.95
- Package / Case :
- TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
- Series :
- HEXFET®
- Drive Voltage (Max Rds On,Min Rds On) :
- 10V
- Additional Feature :
- AVALANCHE RATED
- Pulsed Drain Current-Max (IDM) :
- 84A
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Current - Continuous Drain (Id) @ 25°C :
- 21A Tc
- Peak Reflow Temperature (Cel) :
- 225
- Operating Temperature :
- -55°C~175°C TJ
- FET Type :
- N-Channel
- Vgs (Max) :
- ±20V
- Case Connection :
- DRAIN
- Drain Current-Max (Abs) (ID) :
- 21A
- Terminal Position :
- Single
- RoHS Status :
- Non-RoHS Compliant
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Vgs(th) (Max) @ Id :
- 4V @ 250µA
- Number of Terminations :
- 2
- Surface Mount :
- yes
- DS Breakdown Voltage-Min :
- 150V
- Drain to Source Voltage (Vdss) :
- 150V
- Input Capacitance (Ciss) (Max) @ Vds :
- 1300pF @ 25V
- Configuration :
- SINGLE WITH BUILT-IN DIODE
- Transistor Application :
- SWITCHING
- Power Dissipation-Max :
- 3.8W Ta 94W Tc
- Datasheets
- IRF3315S

N-Channel Tube 82m Ω @ 12A, 10V ±20V 1300pF @ 25V 95nC @ 10V 150V TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
IRF3315S Description
Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with a highly efficient and reliable device for use in a wide variety of applications. The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. TheD2Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application. The through-hole version (IRF3315L) is available for low-profile applications.
IRF3315S Features
Advanced Process Technology
Surface Mount (IRF3315S)
Low-profile through-hole (IRF3315L)
175??C Operating Temperature
Fast Switching
Fully Avalanche Rated
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