IRF7904TRPBF
- Mfr.Part #
- IRF7904TRPBF
- Manufacturer
- Infineon Technologies
- Package / Case
- 8-SOIC (0.154, 3.90mm Width)
- Datasheet
- Download
- Description
- MOSFET 2N-CH 30V 7.6A/11A 8-SOIC
- Stock
- 14,399
- In Stock :
- 14,399
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Arrays
- Drain to Source Breakdown Voltage :
- 30V
- Max Power Dissipation :
- 2W
- Packaging :
- Tape and Reel (TR)
- Published :
- 2006
- Series :
- HEXFET®
- Number of Pins :
- 8
- Factory Lead Time :
- 12 Weeks
- Continuous Drain Current (ID) :
- 11A
- Package / Case :
- 8-SOIC (0.154, 3.90mm Width)
- Height :
- 1.4986mm
- RoHS Status :
- ROHS3 Compliant
- Operating Mode :
- ENHANCEMENT MODE
- Radiation Hardening :
- No
- ECCN Code :
- EAR99
- Resistance :
- 16.2MOhm
- Vgs(th) (Max) @ Id :
- 2.25V @ 25μA
- Number of Terminations :
- 8
- Element Configuration :
- Dual
- Power - Max :
- 1.4W 2W
- Base Part Number :
- IRF7904PBF
- Gate to Source Voltage (Vgs) :
- 20V
- Power Dissipation :
- 2W
- Gate Charge (Qg) (Max) @ Vgs :
- 11nC @ 4.5V
- Mounting Type :
- Surface Mount
- Current - Continuous Drain (Id) @ 25°C :
- 7.6A 11A
- FET Technology :
- METAL-OXIDE SEMICONDUCTOR
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Operating Temperature :
- -55°C~150°C TJ
- Input Capacitance (Ciss) (Max) @ Vds :
- 910pF @ 15V
- Number of Elements :
- 2
- Length :
- 4.9784mm
- FET Feature :
- Logic Level Gate
- Contact Plating :
- Tin
- Transistor Element Material :
- SILICON
- Mount :
- Surface Mount
- Width :
- 3.9878mm
- JESD-609 Code :
- e3
- Rds On (Max) @ Id, Vgs :
- 16.2m Ω @ 7.6A, 10V
- Terminal Form :
- Gull wing
- FET Type :
- 2 N-Channel (Dual)
- Lead Free :
- Lead Free
- Datasheets
- IRF7904TRPBF

IRF7904TRPBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available at
IRF7904TRPBF Description
International Rectifier's Fifth Generation HEXFETs use state-of-the-art manufacturing techniques to generate extremely low on-resistance per silicon area. The designe is provided with an extraordinarily efficient and reliable device for use in a variety of applications thanks to this feature as well as the high switching speed and ruggedized device architecture that HEXFET Power MOSFETs are known for. The SO-8 is ideal for a range of power applications thanks to its enhanced thermal characteristics and multiple-die capacity. The use of a leadframe that was especially created allowed for this alteration. This innovation significantly reduces the amount of board space required while enabling the use of several devices. The package is meant to be used in conjunction with vapor phase infrared technology or wave soldering.
IRF7904TRPBF Features
-
RDS(on) is Very Low at 4.5V VGS.
-
Small Gate Fee
-
Comprehensive Characterization of Avalanche Voltage and Current
-
Max. Gate Rating for 20V VGS
-
improved reverse recovery of the body diode
-
Completely tested to be RG Lead-Free
IRF7904TRPBF Applications
-
POL dual SO-8 MOSFET
-
Converters for servers, notebook computers, and
-
Game consoles, graphics cards, and set-top boxes
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