IRF7351PBF
- Mfr.Part #
- IRF7351PBF
- Manufacturer
- Infineon Technologies
- Package / Case
- 8-SOIC (0.154, 3.90mm Width)
- Datasheet
- Download
- Description
- MOSFET 2N-CH 60V 8A 8-SOIC
- Stock
- 216,464
- In Stock :
- 216,464
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Arrays
- Power - Max :
- 2W
- Input Capacitance (Ciss) (Max) @ Vds :
- 1330pF @ 30V
- Element Configuration :
- Dual
- FET Type :
- 2 N-Channel (Dual)
- Vgs(th) (Max) @ Id :
- 4V @ 50μA
- RoHS Status :
- ROHS3 Compliant
- Fall Time (Typ) :
- 6.7 ns
- FET Feature :
- Logic Level Gate
- Published :
- 2006
- Power Dissipation :
- 2W
- Gate to Source Voltage (Vgs) :
- 20V
- Base Part Number :
- IRF7351PBF
- Continuous Drain Current (ID) :
- 8A
- Series :
- HEXFET®
- Max Power Dissipation :
- 2W
- Current - Continuous Drain (Id) @ 25°C :
- 8A
- Lead Free :
- Lead Free
- Factory Lead Time :
- 15 Weeks
- Drain to Source Resistance :
- 17.8mOhm
- Package / Case :
- 8-SOIC (0.154, 3.90mm Width)
- Packaging :
- Tube
- Min Operating Temperature :
- -55°C
- Threshold Voltage :
- 4V
- Recovery Time :
- 30 ns
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Radiation Hardening :
- No
- Rds On Max :
- 17.8 mΩ
- Max Operating Temperature :
- 150°C
- Number of Elements :
- 2
- Rds On (Max) @ Id, Vgs :
- 17.8mOhm @ 8A, 10V
- Drain to Source Voltage (Vdss) :
- 60V
- Gate Charge (Qg) (Max) @ Vgs :
- 36nC @ 10V
- Mount :
- Surface Mount
- Height :
- 1.4986mm
- Operating Temperature :
- -55°C~150°C TJ
- Number of Pins :
- 8
- Supplier Device Package :
- 8-SO
- Length :
- 4.9784mm
- Rise Time :
- 5.9ns
- Input Capacitance :
- 1.33nF
- REACH SVHC :
- No SVHC
- Turn-Off Delay Time :
- 17 ns
- Drain to Source Breakdown Voltage :
- 60V
- Width :
- 3.9878mm
- Mounting Type :
- Surface Mount
- Nominal Vgs :
- 4 V
- Turn On Delay Time :
- 5.1 ns
- Datasheets
- IRF7351PBF

IRF7351PBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available at
IRF7351PBF Description
HEXFET is trademark of power MOSFET developed by International Rectifier. The HEXFET structure is shown in the figure-2. As shown silicon oxide layer between gate and source regions can be punctured by exceeding its dielectric strength. The symbol is same as power MOSFET as shown in the figure-1. It is a voltage controlled power MOSFET device.
IRF7351PBF Applications
Synchronous Rectifier MOSFET for
Isolated DO-DC Converters
·Low Power Motor Drive Systems
IRF7351PBF Features
Ultra-Low Gate Impedance
Fully Characterized Avalanche Voltage and Current
20V VGs Max. Gate Rating
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