IRF7306TRPBF
- Mfr.Part #
- IRF7306TRPBF
- Manufacturer
- Infineon Technologies
- Package / Case
- 8-SOIC (0.154, 3.90mm Width)
- Datasheet
- Download
- Description
- MOSFET 2P-CH 30V 3.6A 8-SOIC
- Stock
- 51,712
- In Stock :
- 51,712
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Arrays
- Recovery Time :
- 80 ns
- Terminal Form :
- Gull wing
- Length :
- 4.9784mm
- ECCN Code :
- EAR99
- Mounting Type :
- Surface Mount
- Operating Temperature :
- -55°C~150°C TJ
- Drain to Source Voltage (Vdss) :
- 30V
- Continuous Drain Current (ID) :
- -3.6A
- Mount :
- Surface Mount
- Base Part Number :
- IRF7306PBF
- Resistance :
- 100MOhm
- Transistor Application :
- SWITCHING
- Factory Lead Time :
- 12 Weeks
- Package / Case :
- 8-SOIC (0.154, 3.90mm Width)
- Number of Elements :
- 2
- Turn On Delay Time :
- 11 ns
- Series :
- HEXFET®
- Current Rating :
- -3.6A
- Power Dissipation :
- 2W
- JESD-609 Code :
- e3
- Vgs(th) (Max) @ Id :
- 1V @ 250μA
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- RoHS Status :
- ROHS3 Compliant
- Drain to Source Breakdown Voltage :
- -30V
- Additional Feature :
- ULTRA LOW RESISTANCE
- Number of Pins :
- 8
- Voltage - Rated DC :
- -30V
- Number of Channels :
- 2
- Width :
- 4.05mm
- Contact Plating :
- Tin
- Gate to Source Voltage (Vgs) :
- 20V
- Rds On (Max) @ Id, Vgs :
- 100m Ω @ 1.8A, 10V
- Published :
- 1997
- Number of Terminations :
- 8
- Turn-Off Delay Time :
- 25 ns
- REACH SVHC :
- No SVHC
- Max Power Dissipation :
- 2W
- Fall Time (Typ) :
- 18 ns
- Lead Free :
- Lead Free
- Gate Charge (Qg) (Max) @ Vgs :
- 25nC @ 10V
- FET Type :
- 2 P-Channel (Dual)
- Radiation Hardening :
- No
- Element Configuration :
- Dual
- Max Junction Temperature (Tj) :
- 150°C
- Nominal Vgs :
- -1 V
- Pulsed Drain Current-Max (IDM) :
- 14A
- Rise Time :
- 17ns
- Threshold Voltage :
- -1V
- Packaging :
- Tape and Reel (TR)
- Input Capacitance (Ciss) (Max) @ Vds :
- 440pF @ 25V
- Current - Continuous Drain (Id) @ 25°C :
- 3.6A
- Height :
- 1.75mm
- Transistor Element Material :
- SILICON
- FET Technology :
- METAL-OXIDE SEMICONDUCTOR
- Row Spacing :
- 6.3 mm
- Operating Mode :
- ENHANCEMENT MODE
- FET Feature :
- Logic Level Gate
- Datasheets
- IRF7306TRPBF

IRF7306TRPBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available at
IRF7306TRPBF Description
The fifth generation HEXFET of the International Rectifier Company adopts advanced processing technology to achieve the lowest possible switch. This advantage, combined with HEXFET Power MOSFET's well-known fast switching speed and rugged device design, provides designers with an extremely efficient device that can be used in a variety of applications.
The SO-8 has been modified through a custom lead frame to enhance its thermal characteristics and multi-chip capabilities, making it an ideal choice for a variety of power applications. Multiple devices can be used in one application, greatly reducing the circuit board space. The package is designed for the vapor phase. Infrared wave soldering technology. In typical printed circuit board installation applications, it is possible to consume more than 0.8W.
IRF7306TRPBF Features
Generation V Technology
Ultra Low On-Resistance
Dual P-Channel Mosfet
Surface Mount
Available in Tape &Reel
Dynamic dv/dt Rating
Fast Switching
Lead-Free
IRF7306TRPBF Applications
HEXFET Power MOSFET's well-known fast switching speed and rugged device design, provides designers with an extremely efficient device that can be used in a variety of applications.
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