IRF6100
- Mfr.Part #
- IRF6100
- Manufacturer
- Infineon Technologies
- Package / Case
- 4-FlipFet™
- Datasheet
- Download
- Description
- MOSFET P-CH 20V 5.1A 4FLIPFET
- Stock
- 48,637
- In Stock :
- 48,637
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Single
- Mounting Type :
- Surface Mount
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Published :
- 2006
- Continuous Drain Current (ID) :
- 5.1A
- RoHS Status :
- Non-RoHS Compliant
- Gate Charge (Qg) (Max) @ Vgs :
- 21nC @ 5V
- FET Type :
- P-Channel
- Rise Time :
- 12ns
- Lead Free :
- Contains Lead
- Mount :
- Surface Mount
- Package / Case :
- 4-FlipFet™
- Series :
- HEXFET®
- Input Capacitance (Ciss) (Max) @ Vds :
- 1230pF @ 15V
- Rds On Max :
- 65 mΩ
- Supplier Device Package :
- 4-FlipFet™
- Current Rating :
- -5.1A
- Current - Continuous Drain (Id) @ 25°C :
- 5.1A Ta
- Vgs (Max) :
- ±12V
- Drain to Source Voltage (Vdss) :
- 20V
- Voltage - Rated DC :
- -20V
- Input Capacitance :
- 1.23nF
- Number of Pins :
- 4
- Packaging :
- Cut Tape (CT)
- Vgs(th) (Max) @ Id :
- 1.2V @ 250µA
- Power Dissipation-Max :
- 2.2W Ta
- Rds On (Max) @ Id, Vgs :
- 65mOhm @ 5.1A, 4.5V
- Operating Temperature :
- -55°C~150°C TJ
- Drive Voltage (Max Rds On,Min Rds On) :
- 2.5V 4.5V
- Datasheets
- IRF6100
P-Channel Cut Tape (CT) 65mOhm @ 5.1A, 4.5V ±12V 1230pF @ 15V 21nC @ 5V 20V 4-FlipFet™
Description
The IRF6100 is a HEXFET? Power MOSFET. International Rectifier offers genuine chip-scale packaging. Extremely low on-resistance and the highest power densities in the industry have been made accessible for battery and load management applications through the use of cutting-edge processing techniques and a novel packaging architecture. These advantages, along with the ruggedized device design for which International Rectifier is renowned, give the designer access to a very effective and dependable tool.
The FlipFET? package has a profile of less than.8mm and has a footprint that is one-third that of a comparable SOT-23 package. This makes the FlipFET? the ideal device for applications where printed circuit board space is at a premium and in extremely thin application contexts, such as battery packs, cell phones, and PCMCIA cards. This is combined with the low thermal resistance of the die-level device.
Features
-
One-third Footprint of SOT-23
-
Super Low Profile (<.8mm)
-
Available Tested on Tape & Reel
-
Ultra Low RDS(on) per Footprint Area
-
Low Thermal Resistance
-
P-Channel MOSFET
Applications
-
Battery packs
-
Cell phones
-
PCMCIA cards
-
Solar inverters
-
Automotive applications
-
Switch, buck and synchronous rectification
-
Small motor control
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