X66AK2H12XAAW2
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- Mfr.Part #
- X66AK2H12XAAW2
- Manufacturer
- Texas Instruments
- Package / Case
- 1517-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC DSP ARM SOC BGA
- Stock
- 35,908
- In Stock ：
- 35,908
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- Manufacturer :
- Texas Instruments
- Product Category :
- DSP (Digital Signal Processors)
- Length :
- 38mm
- Series :
- 66AK2Hx KeyStone Multicore
- Terminal Pitch :
- 1mm
- Min Supply Voltage :
- 800mV
- Lead Free :
- Contains Lead
- Supply Voltage :
- 1V
- Frequency :
- 1.2GHz
- Max Supply Voltage :
- 1.1V
- RAM Size :
- 32kB
- Number of Timers/Counters :
- 20
- Packaging :
- Tray
- Boundary Scan :
- yes
- Format :
- Floating Point
- Memory Size :
- 4MB
- Low Power Mode :
- yes
- Terminal Position :
- BOTTOM
- JESD-30 Code :
- S-PBGA-B1517
- Base Part Number :
- 66AK2H12
- Operating Temperature :
- 0°C~85°C TC
- Height :
- 800μm
- Voltage - Core :
- Variable
- Package / Case :
- 1517-BBGA, FCBGA
- Interface :
- EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0
- Terminal Form :
- Ball
- Type :
- DSP+ARM®
- Core Architecture :
- ARM
- Number of I/O :
- 32
- On Chip Data RAM :
- 12.75MB
- Pbfree Code :
- No
- Mounting Type :
- Surface Mount
- Integrated Cache :
- yes
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Non-Volatile Memory :
- ROM (384kB)
- Voltage - I/O :
- 0.85V 1.0V 1.35V 1.5V 1.8V 3.3V
- RoHS Status :
- Non-RoHS Compliant
- Width :
- 38mm
- Mount :
- Surface Mount
- Datasheets
- X66AK2H12XAAW2
DSP Texas Instruments X66AK2H12XAAW2 Overview
The DSP Texas Instruments X66AK2H12XAAW2 is a highly integrated and advanced digital signal processor (DSP) SOC (System on Chip) designed by Texas Instruments, a leader in semiconductor innovation. This SOC leverages the power of ARM architecture to deliver superior processing capabilities ideal for a range of demanding applications. As a DSP, it is specifically engineered to handle complex digital signal processing tasks with efficiency and high performance, making it a perfect choice for designers looking to integrate robust processing power into their systems. This product's enhanced features and versatile integration options make it a prime candidate for bulk purchase by businesses aiming to develop cutting-edge technology solutions.
X66AK2H12XAAW2 Features
The X66AK2H12XAAW2 DSP by Texas Instruments comes packed with features that optimize performance and functionality in high-demand systems. These include advanced ARM SOC architecture, high-speed signal processing capabilities, and a compact BGA (Ball Grid Array) package for reduced space usage on printed circuit boards (PCBs). These characteristics are designed to support scalable solutions in various technological environments.
X66AK2H12XAAW2 Applications
- Telecommunications: This DSP is ideal for use in telecommunications equipment, where it can manage and enhance signal processing operations for clear and reliable communication.
- Audio Processing: In audio systems, the X66AK2H12XAAW2 can be used to execute complex algorithms required for audio encoding and decoding, offering high-fidelity sound production.
- Medical Imaging: Medical imaging devices benefit from the high-performance signal processing capabilities of this DSP, enabling them to handle large data sets and complex imaging algorithms efficiently.
- Automotive Systems: The robust processing power of the X66AK2H12XAAW2 supports advanced automotive applications, such as driver assistance systems, enhancing safety and performance on the road.
- Industrial Automation: In industrial settings, this processor facilitates the management and automation of various machinery and processes, increasing operational efficiency and reliability.
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