X66AK2H06AAAWA2

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Mfr.Part #
X66AK2H06AAAWA2
Manufacturer
Texas Instruments
Package / Case
1517-BBGA, FCBGA
Datasheet
Download
Description
IC DSP ARM SOC BGA
Stock
4,373
In Stock :
4,373

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Manufacturer :
Texas Instruments
Product Category :
DSP (Digital Signal Processors)
Boundary Scan :
yes
Min Supply Voltage :
902mV
Address Bus Width :
24
Type :
DSP+ARM®
Terminal Position :
BOTTOM
Pbfree Code :
No
HTS Code :
8542.31.00.01
Frequency :
1.2GHz
Supply Voltage :
1V
Max Supply Voltage :
997mV
Non-Volatile Memory :
ROM (384kB)
Format :
Floating Point
Terminal Pitch :
1mm
Height Seated (Max) :
3.75mm
Packaging :
Tray
Voltage - Core :
Variable
Low Power Mode :
yes
Lead Free :
Contains Lead
Package / Case :
1517-BBGA, FCBGA
Length :
40mm
Base Part Number :
66AK2H06
Series :
66AK2Hx KeyStone Multicore
Integrated Cache :
yes
Number of Pins :
1517
Speed :
1200 MHz
Interface :
EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0
RAM Size :
6MB
Voltage - I/O :
0.85V 1.0V 1.35V 1.5V 1.8V 3.3V
Mount :
Surface Mount
Operating Temperature :
-40°C~100°C TC
ECCN Code :
3A001.A.3
Number of Timers/Counters :
14
Mounting Type :
Surface Mount
Core Architecture :
ARM
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Terminal Form :
Ball
RoHS Status :
Non-RoHS Compliant
Data Bus Width :
32b
Radiation Hardening :
No
Operating Supply Voltage :
950mV
On Chip Data RAM :
8.375MB
Datasheets
X66AK2H06AAAWA2
Introducing DSP (Digital Signal Processors) Texas Instruments X66AK2H06AAAWA2 from Chip IC,where excellence meets affordability. This product stands out with its Type:DSP+ARM®, Package / Case:1517-BBGA, FCBGA, Base Part Number:66AK2H06, Number of Pins:1517, Operating Temperature:-40°C~100°C TC, Mounting Type:Surface Mount, X66AK2H06AAAWA2 pinout, X66AK2H06AAAWA2 datasheet PDF, X66AK2H06AAAWA2 amp .Beyond DSP (Digital Signal Processors) Texas Instruments X66AK2H06AAAWA2 ,we also offer TMS320VC5416PGE160, TMS320C6713BZDP300, ADSP-21369KBPZ-3A, Our vast inventory has you covered. Contact us now for immediate solutions.

Texas Instruments X66AK2H06AAAWA2


DSP Texas Instruments X66AK2H06AAAWA2 Overview

Introducing the DSP Texas Instruments X66AK2H06AAAWA2, a high-performance IC DSP ARM SOC in a compact BGA package, designed to cater to demanding digital processing tasks. This product, engineered by Texas Instruments, one of the leading semiconductor manufacturers, integrates advanced digital signal processing capabilities with the power efficiency of ARM architecture. The X66AK2H06AAAWA2 is tailored for applications requiring intensive computational operations and real-time data processing, making it an ideal choice for industries looking to optimize their technological solutions.

X66AK2H06AAAWA2 Features

The X66AK2H06AAAWA2 stands out for its robust feature set, including advanced ARM Cortex cores and versatile DSP engines that provide high computational throughput and efficiency. This SOC offers low-power operation modes, high-speed interfacing options, and extensive on-chip memory, facilitating complex algorithms and multitasking environments. Additionally, its BGA packaging ensures a reduced footprint and enhanced reliability for densely packed electronics.

X66AK2H06AAAWA2 Applications

  • Automotive Advanced Driver-Assistance Systems (ADAS): Utilizes its DSP capabilities to process real-time sensor data, aiding in features like object detection and automatic braking.
  • Medical Imaging Devices: Employs its high processing power to handle complex image reconstruction algorithms, essential for CT scanners and MRI machines.
  • Wireless Communication Systems: Supports advanced algorithms for signal modulation and coding, crucial in 5G base stations and network infrastructure.
  • Industrial Automation: Integrates into control systems for real-time processing tasks, optimizing operations and machine learning applications in manufacturing settings.
  • Consumer Electronics: Drives features in devices such as smartphones and tablets, enhancing multimedia experiences and user interface responsiveness.
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