X66AK2H06AAAWA2
- Mfr.Part #
- X66AK2H06AAAWA2
- Manufacturer
- Texas Instruments
- Package / Case
- 1517-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC DSP ARM SOC BGA
- Stock
- 4,373
- In Stock :
- 4,373
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- * Fullname:
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- Manufacturer :
- Texas Instruments
- Product Category :
- DSP (Digital Signal Processors)
- Boundary Scan :
- yes
- Min Supply Voltage :
- 902mV
- Address Bus Width :
- 24
- Type :
- DSP+ARM®
- Terminal Position :
- BOTTOM
- Pbfree Code :
- No
- HTS Code :
- 8542.31.00.01
- Frequency :
- 1.2GHz
- Supply Voltage :
- 1V
- Max Supply Voltage :
- 997mV
- Non-Volatile Memory :
- ROM (384kB)
- Format :
- Floating Point
- Terminal Pitch :
- 1mm
- Height Seated (Max) :
- 3.75mm
- Packaging :
- Tray
- Voltage - Core :
- Variable
- Low Power Mode :
- yes
- Lead Free :
- Contains Lead
- Package / Case :
- 1517-BBGA, FCBGA
- Length :
- 40mm
- Base Part Number :
- 66AK2H06
- Series :
- 66AK2Hx KeyStone Multicore
- Integrated Cache :
- yes
- Number of Pins :
- 1517
- Speed :
- 1200 MHz
- Interface :
- EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0
- RAM Size :
- 6MB
- Voltage - I/O :
- 0.85V 1.0V 1.35V 1.5V 1.8V 3.3V
- Mount :
- Surface Mount
- Operating Temperature :
- -40°C~100°C TC
- ECCN Code :
- 3A001.A.3
- Number of Timers/Counters :
- 14
- Mounting Type :
- Surface Mount
- Core Architecture :
- ARM
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Terminal Form :
- Ball
- RoHS Status :
- Non-RoHS Compliant
- Data Bus Width :
- 32b
- Radiation Hardening :
- No
- Operating Supply Voltage :
- 950mV
- On Chip Data RAM :
- 8.375MB
- Datasheets
- X66AK2H06AAAWA2

DSP Texas Instruments X66AK2H06AAAWA2 Overview
Introducing the DSP Texas Instruments X66AK2H06AAAWA2, a high-performance IC DSP ARM SOC in a compact BGA package, designed to cater to demanding digital processing tasks. This product, engineered by Texas Instruments, one of the leading semiconductor manufacturers, integrates advanced digital signal processing capabilities with the power efficiency of ARM architecture. The X66AK2H06AAAWA2 is tailored for applications requiring intensive computational operations and real-time data processing, making it an ideal choice for industries looking to optimize their technological solutions.
X66AK2H06AAAWA2 Features
The X66AK2H06AAAWA2 stands out for its robust feature set, including advanced ARM Cortex cores and versatile DSP engines that provide high computational throughput and efficiency. This SOC offers low-power operation modes, high-speed interfacing options, and extensive on-chip memory, facilitating complex algorithms and multitasking environments. Additionally, its BGA packaging ensures a reduced footprint and enhanced reliability for densely packed electronics.
X66AK2H06AAAWA2 Applications
- Automotive Advanced Driver-Assistance Systems (ADAS): Utilizes its DSP capabilities to process real-time sensor data, aiding in features like object detection and automatic braking.
- Medical Imaging Devices: Employs its high processing power to handle complex image reconstruction algorithms, essential for CT scanners and MRI machines.
- Wireless Communication Systems: Supports advanced algorithms for signal modulation and coding, crucial in 5G base stations and network infrastructure.
- Industrial Automation: Integrates into control systems for real-time processing tasks, optimizing operations and machine learning applications in manufacturing settings.
- Consumer Electronics: Drives features in devices such as smartphones and tablets, enhancing multimedia experiences and user interface responsiveness.
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