X66AK2H06AAWA2
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- Mfr.Part #
- X66AK2H06AAWA2
- Manufacturer
- Texas Instruments
- Package / Case
- 1517-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC DSP ARM SOC BGA
- Stock
- 36,605
- In Stock ：
- 36,605
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- Manufacturer :
- Texas Instruments
- Product Category :
- DSP (Digital Signal Processors)
- Width :
- 38mm
- RoHS Status :
- Non-RoHS Compliant
- Mount :
- Surface Mount
- Base Part Number :
- 66AK2H06
- Non-Volatile Memory :
- ROM (384kB)
- Series :
- 66AK2Hx KeyStone Multicore
- Package / Case :
- 1517-BBGA, FCBGA
- On Chip Data RAM :
- 8.375MB
- Supply Voltage :
- 1V
- Packaging :
- Tray
- Memory Size :
- 4MB
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Format :
- Floating Point
- ECCN Code :
- 3A001.A.3
- RAM Size :
- 32kB
- Low Power Mode :
- yes
- Number of I/O :
- 32
- Voltage - I/O :
- 0.85V 1.0V 1.35V 1.5V 1.8V 3.3V
- Type :
- DSP+ARM®
- Lead Free :
- Contains Lead
- Min Supply Voltage :
- 800mV
- Max Supply Voltage :
- 1.1V
- Mounting Type :
- Surface Mount
- Boundary Scan :
- yes
- Terminal Pitch :
- 1mm
- Pbfree Code :
- No
- Number of UART Channels :
- 2
- Integrated Cache :
- yes
- Length :
- 38mm
- Core Architecture :
- ARM
- Frequency :
- 1.2GHz
- JESD-30 Code :
- S-PBGA-B1517
- Voltage - Core :
- Variable
- Height :
- 800μm
- Terminal Position :
- BOTTOM
- Operating Temperature :
- -40°C~100°C TC
- Interface :
- EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0
- Number of Timers/Counters :
- 20
- Terminal Form :
- Ball
- Datasheets
- X66AK2H06AAWA2
DSP Texas Instruments X66AK2H06AAWA2 Overview
The DSP Texas Instruments X66AK2H06AAWA2 is a high-performance Integrated Circuit specifically designed for advanced digital signal processing (DSP) applications. Developed by Texas Instruments, a leader in semiconductor innovation, the X66AK2H06AAWA2 combines the efficiency of ARM architecture with the robust processing power of a DSP, making it an ideal choice for a wide range of industrial and technological applications. This product not only supports complex signal processing algorithms but also enhances system reliability with its integrated SOC (System on Chip) architecture packed in a compact BGA (Ball Grid Array) package, providing significant advantages in terms of space and power efficiency.
X66AK2H06AAWA2 Features
The X66AK2H06AAWA2 boasts several key features that make it a top pick for developers and engineers looking to leverage cutting-edge technology in their products. These features include advanced ARM cores for efficient data management, a powerful DSP for handling intricate signal processing tasks, and a BGA package that ensures a reduced footprint on physical boards. Additionally, its SOC design integrates multiple components into a single chip, reducing the need for multiple separate chips and thereby minimizing the overall system complexity and enhancing reliability.
X66AK2H06AAWA2 Applications
- Telecommunications: In telecom equipment, the X66AK2H06AAWA2 processes complex algorithms for signal modulation and demodulation, facilitating faster data transmission and improved signal quality.
- Automotive Systems: Utilized in advanced driver-assistance systems (ADAS), this IC enhances functionality by processing real-time data from sensors, aiding in collision avoidance and vehicle automation.
- Medical Devices: In medical imaging systems, the DSP capabilities of the X66AK2H06AAWA2 allow for the real-time processing of high-resolution images, crucial for accurate diagnostics.
- Audio Processing: The IC excels in applications requiring high fidelity audio signal processing, offering crystal clear sound quality for both consumer and professional audio equipment.
- Industrial Automation: This SOC is integral in controlling and monitoring machinery in automated production lines, improving operational efficiency and safety through precise control algorithms.
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