X66AK2H06AAAWA24
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- Mfr.Part #
- X66AK2H06AAAWA24
- Manufacturer
- Texas Instruments
- Package / Case
- 1517-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC DSP ARM SOC BGA
- Stock
- 16,476
- In Stock ：
- 16,476
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- Manufacturer :
- Texas Instruments
- Product Category :
- DSP (Digital Signal Processors)
- Type :
- DSP+ARM®
- Interface :
- EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0
- Length :
- 40mm
- On Chip Data RAM :
- 8.375MB
- Additional Feature :
- ALSO OPERATES AT 1200 GHZ
- Frequency :
- 1.4GHz
- Min Supply Voltage :
- 902mV
- Core Architecture :
- ARM
- Address Bus Width :
- 24
- Supply Voltage :
- 1V
- Data Bus Width :
- 32b
- Series :
- 66AK2Hx KeyStone Multicore
- Integrated Cache :
- yes
- Pbfree Code :
- No
- Non-Volatile Memory :
- ROM (384kB)
- Operating Supply Voltage :
- 950mV
- Max Supply Voltage :
- 997mV
- Mount :
- Surface Mount
- Height Seated (Max) :
- 3.75mm
- Radiation Hardening :
- No
- Package / Case :
- 1517-BBGA, FCBGA
- Clock Rate :
- 1.2GHz DSP, 1.4GHz ARM®
- Lead Free :
- Contains Lead
- Mounting Type :
- Surface Mount
- RAM Size :
- 6MB
- Terminal Pitch :
- 1mm
- Low Power Mode :
- yes
- Number of Pins :
- 1517
- Voltage - I/O :
- 0.85V 1.0V 1.35V 1.5V 1.8V 3.3V
- Operating Temperature :
- -40°C~100°C TC
- Format :
- Floating Point
- Packaging :
- Tray
- Terminal Position :
- BOTTOM
- Voltage - Core :
- Variable
- RoHS Status :
- Non-RoHS Compliant
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Boundary Scan :
- yes
- Number of Timers/Counters :
- 14
- Base Part Number :
- 66AK2H06
- Terminal Form :
- Ball
- Datasheets
- X66AK2H06AAAWA24
DSP Texas Instruments X66AK2H06AAAWA24 Overview
The DSP Texas Instruments X66AK2H06AAAWA24 is a highly integrated digital signal processor (DSP) designed for advanced applications that require robust processing capabilities. This IC DSP ARM SOC BGA from Texas Instruments excels in delivering high-performance signal processing with its ARM architecture, making it an ideal choice for demanding embedded applications. The integration of DSP with ARM SOC in a BGA package allows for compact and efficient designs, facilitating better thermal management and reduced footprint on PCBs. Its versatility is suited for a range of industrial, automotive, and communication applications, emphasizing its capability to handle complex algorithms and data-intensive tasks.
X66AK2H06AAAWA24 Features
This SOC features an advanced ARM processor core integrated with powerful digital signal processing capabilities. The combination provides exceptional computational speed and efficiency, suitable for handling complex signal processing tasks seamlessly. The BGA packaging ensures high-density mounting and excellent thermal properties, which are critical for maintaining reliability and performance in rigorous environments. Moreover, its low power consumption makes it an energy-efficient choice for sustained operations.
X66AK2H06AAAWA24 Applications
- Automotive Systems: Utilized in advanced driver-assistance systems (ADAS) to process real-time data from sensors and cameras, enhancing vehicle safety and functionality.
- Industrial Automation: Powers control systems for machinery and production lines, optimizing performance through fast and accurate signal processing.
- Telecommunications: Integral in communication infrastructure, facilitating signal processing tasks for data transmission and reception with high reliability.
- Medical Devices: Employed in medical imaging systems such as ultrasound and MRI to process complex visual data for diagnostics.
- Consumer Electronics: Supports features in high-end audio and video devices, ensuring high-quality output through efficient signal processing.
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