X66AK2H06AXAAW2
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- Mfr.Part #
- X66AK2H06AXAAW2
- Manufacturer
- Texas Instruments
- Package / Case
- 1517-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC DSP ARM SOC BGA
- Stock
- 26,243
- In Stock ：
- 26,243
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- Manufacturer :
- Texas Instruments
- Product Category :
- DSP (Digital Signal Processors)
- Supply Voltage :
- 1V
- Address Bus Width :
- 24
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Interface :
- EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0
- Voltage - I/O :
- 0.85V 1.0V 1.35V 1.5V 1.8V 3.3V
- Speed :
- 1200 MHz
- Packaging :
- Tray
- Operating Temperature :
- 0°C~85°C TC
- RAM Size :
- 512kB
- Terminal Position :
- BOTTOM
- Core Architecture :
- ARM
- Terminal Form :
- Ball
- Format :
- Floating Point
- Type :
- DSP+ARM®
- Number of Pins :
- 1517
- External Data Bus Width :
- 16
- Pbfree Code :
- No
- Memory Type :
- SRAM
- RoHS Status :
- Non-RoHS Compliant
- Lead Free :
- Contains Lead
- Frequency :
- 1.2GHz
- Low Power Mode :
- yes
- Boundary Scan :
- yes
- Height Seated (Max) :
- 3.75mm
- Mounting Type :
- Surface Mount
- Integrated Cache :
- yes
- Package / Case :
- 1517-BBGA, FCBGA
- Terminal Pitch :
- 1mm
- On Chip Data RAM :
- 8.375MB
- Non-Volatile Memory :
- ROM (384kB)
- Mount :
- Surface Mount
- Min Supply Voltage :
- 902mV
- Series :
- 66AK2Hx KeyStone Multicore
- Number of Timers/Counters :
- 14
- Length :
- 40mm
- Width :
- 40mm
- Base Part Number :
- 66AK2H06
- Voltage - Core :
- Variable
- Datasheets
- X66AK2H06AXAAW2
DSP Texas Instruments X66AK2H06AXAAW2 Overview
The DSP Texas Instruments X66AK2H06AXAAW2 is a high-performance integrated circuit specifically designed for advanced digital signal processing applications. Manufactured by Texas Instruments, a leader in semiconductor innovation, this IC leverages the robust capabilities of an ARM SOC architecture, making it ideal for handling complex computations and enhancing signal integrity in various electronic products. Its compact BGA packaging ensures that it can be integrated into systems where space is at a premium, yet high processing power is required. This DSP is particularly suited for developers looking to deploy sophisticated algorithms in audio, video, and other real-time processing environments.
X66AK2H06AXAAW2 Features
The X66AK2H06AXAAW2 from Texas Instruments incorporates a multitude of features that make it a versatile choice for a wide range of applications. Its ARM-based SOC architecture provides efficient processing capabilities, which are essential for handling demanding signal processing tasks. The integration in a BGA package allows for superior thermal management and reduced footprint on the circuit board. Additionally, the device supports various interfaces and protocols, enhancing its adaptability to new and legacy systems alike.
X66AK2H06AXAAW2 Applications
- Audio Processing Systems: Utilized in devices requiring high fidelity and real-time audio processing, such as professional audio equipment, where it enhances sound quality and reduces latency.
- Video Processing Equipment: Applied in systems needing advanced video processing capabilities, like surveillance cameras and video conferencing tools, to improve image clarity and processing speed.
- Telecommunications: Used in telecommunications infrastructure to manage signal integrity and processing needs, ensuring clear and reliable communication.
- Medical Imaging Devices: Integral in medical imaging systems, such as MRI and ultrasound machines, where its processing power helps in rendering high-resolution images swiftly.
- Industrial Control Systems: Deployed in industrial automation for real-time control and processing tasks, improving efficiency and reliability of automated processes.
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