X66AK2H12AAAW2
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- Mfr.Part #
- X66AK2H12AAAW2
- Manufacturer
- Texas Instruments
- Package / Case
- 1517-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC DSP ARM SOC BGA
- Stock
- 5,368
- In Stock ：
- 5,368
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- Manufacturer :
- Texas Instruments
- Product Category :
- DSP (Digital Signal Processors)
- Pbfree Code :
- yes
- Peak Reflow Temperature (Cel) :
- 245
- Voltage - I/O :
- 0.85V 1.0V 1.35V 1.5V 1.8V 3.3V
- ECCN Code :
- 3A001.A.3
- Mounting Type :
- Surface Mount
- Address Bus Width :
- 24
- Low Power Mode :
- yes
- Terminal Form :
- Ball
- Height Seated (Max) :
- 3.75mm
- Type :
- DSP+ARM®
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Min Supply Voltage :
- 902mV
- Lead Free :
- Lead Free
- Packaging :
- Tray
- Boundary Scan :
- yes
- JESD-609 Code :
- e1
- Non-Volatile Memory :
- ROM (384kB)
- Terminal Pitch :
- 1mm
- Memory Type :
- SRAM
- Base Part Number :
- 66AK2H12
- Width :
- 40mm
- Voltage - Core :
- Variable
- Mount :
- Surface Mount
- HTS Code :
- 8542.31.00.01
- Operating Temperature :
- 0°C~85°C TC
- Terminal Position :
- BOTTOM
- Length :
- 40mm
- Series :
- 66AK2Hx KeyStone Multicore
- Interface :
- EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0
- Number of Pins :
- 1517
- RoHS Status :
- Non-RoHS Compliant
- Core Architecture :
- ARM
- Number of Timers/Counters :
- 20
- Supply Voltage :
- 1V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- External Data Bus Width :
- 16
- Package / Case :
- 1517-BBGA, FCBGA
- Frequency :
- 1.2GHz
- Integrated Cache :
- yes
- Format :
- Floating Point
- On Chip Data RAM :
- 12.75MB
- RAM Size :
- 512kB
- Datasheets
- X66AK2H12AAAW2
DSP Texas Instruments X66AK2H12AAAW2 Overview
The DSP Texas Instruments X66AK2H12AAAW2 is a highly integrated digital signal processor (DSP) designed for advanced signal processing applications. This ARM-based SoC (System on Chip) encapsulated in a BGA (Ball Grid Array) package delivers high-performance computation capabilities, making it suitable for intensive processing tasks. Its robust architecture enables efficient handling of complex algorithms and support for multiple signal processing functions which are crucial for real-time applications. The integration of ARM technology ensures that the device is not only powerful but also energy-efficient, providing an optimal solution for developers looking to balance power and performance in their designs.
X66AK2H12AAAW2 Features
The Texas Instruments X66AK2H12AAAW2 DSP boasts a suite of features that enhance its usability and functionality in various applications. These include high-speed processing capabilities, a flexible and scalable architecture, and compatibility with multiple interfaces and software platforms. The BGA packaging allows for more compact and efficient designs, facilitating easier integration into existing technology frameworks without compromising performance.
X66AK2H12AAAW2 Applications
- Automotive Advanced Driver Assistance Systems (ADAS): Utilizes the DSP's processing power to interpret sensor data in real time, enhancing vehicle safety and performance.
- Mobile Communication Devices: Supports high-quality audio and video processing to deliver enhanced multimedia experiences in smartphones and tablets.
- Industrial Automation: Capable of handling complex control algorithms to improve automation and productivity in manufacturing environments.
- Healthcare Equipment: Assists in the processing and analysis of medical imaging data, contributing to faster and more accurate diagnostics.
- Consumer Electronics: Powers advanced features in devices such as digital cameras and home entertainment systems, improving user interfaces and functionality.
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