X66AK2H06AAWA24
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- Mfr.Part #
- X66AK2H06AAWA24
- Manufacturer
- Texas Instruments
- Package / Case
- 1517-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC DSP ARM SOC BGA
- Stock
- 24,174
- In Stock ：
- 24,174
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- Manufacturer :
- Texas Instruments
- Product Category :
- DSP (Digital Signal Processors)
- Max Supply Voltage :
- 1.1V
- Lead Free :
- Contains Lead
- Supply Voltage :
- 1V
- Terminal Position :
- BOTTOM
- Frequency :
- 1.4GHz
- Type :
- DSP+ARM®
- Mounting Type :
- Surface Mount
- Series :
- 66AK2Hx KeyStone Multicore
- Terminal Form :
- Ball
- JESD-30 Code :
- S-PBGA-B1517
- Packaging :
- Tray
- RoHS Status :
- Non-RoHS Compliant
- Speed :
- 1400 MHz
- Width :
- 38mm
- Boundary Scan :
- yes
- Voltage - Core :
- Variable
- Number of I/O :
- 32
- Interface :
- EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0
- Mount :
- Surface Mount
- Number of UART Channels :
- 2
- Low Power Mode :
- yes
- Non-Volatile Memory :
- ROM (384kB)
- Length :
- 38mm
- Core Architecture :
- ARM
- Package / Case :
- 1517-BBGA, FCBGA
- Voltage - I/O :
- 0.85V 1.0V 1.35V 1.5V 1.8V 3.3V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Pbfree Code :
- No
- Number of Timers/Counters :
- 20
- Base Part Number :
- 66AK2H06
- Terminal Pitch :
- 1mm
- Min Supply Voltage :
- 800mV
- Operating Temperature :
- -40°C~100°C TC
- Memory Size :
- 4MB
- Clock Rate :
- 1.2GHz DSP, 1.4GHz ARM®
- RAM Size :
- 32kB
- Format :
- Floating Point
- On Chip Data RAM :
- 8.375MB
- ECCN Code :
- 3A001.A.3
- Integrated Cache :
- yes
- Height :
- 800μm
- Datasheets
- X66AK2H06AAWA24
DSP Texas Instruments X66AK2H06AAWA24 Overview
The DSP Texas Instruments X66AK2H06AAWA24 is an advanced integrated circuit that epitomizes cutting-edge technology in digital signal processing. Specifically designed for demanding applications that require high-speed data processing and efficient power management, this SOC (System on Chip) integrates an ARM processor with DSP capabilities, making it ideal for a multitude of industrial and commercial applications. Its BGA (Ball Grid Array) packaging ensures robust, reliable connections and enhanced thermal performance, critical for high-performance computing environments.
X66AK2H06AAWA24 Features
This SOC features a powerful ARM processor, integrated DSP for real-time signal processing, and a compact BGA package that supports enhanced thermal dissipation and space-saving design. Its ability to handle complex algorithms with ease makes it a prime choice for developers looking to leverage advanced computing in compact devices.
X66AK2H06AAWA24 Applications
- Automotive Advanced Driver Assistance Systems (ADAS): Utilizes the DSP capabilities to process real-time sensor data for collision detection and traffic navigation.
- Smart Home Devices: Employs its efficient processing power to manage voice and image recognition algorithms, enhancing device responsiveness and user interaction.
- Industrial Automation: Applies its robust processing strength in managing real-time control systems and machinery operation, significantly improving efficiency and safety.
- Mobile Communication Devices: Supports complex signal processing tasks such as encoding and decoding, which are essential for high-speed mobile communications and multimedia applications.
- Medical Imaging Systems: Handles intensive computations required for high-resolution imaging techniques, crucial for diagnostic medical devices.
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