X66AK2H06AAW24
- Mfr.Part #
- X66AK2H06AAW24
- Manufacturer
- Texas Instruments
- Package / Case
- 1517-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC DSP ARM SOC BGA
- Stock
- 5,668
- In Stock :
- 5,668
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- Manufacturer :
- Texas Instruments
- Product Category :
- DSP (Digital Signal Processors)
- Speed :
- 1400 MHz
- Mount :
- Surface Mount
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Number of I/O :
- 32
- Series :
- 66AK2Hx KeyStone Multicore
- Boundary Scan :
- yes
- Integrated Cache :
- yes
- Lead Free :
- Contains Lead
- Width :
- 38mm
- Clock Rate :
- 1.2GHz DSP, 1.4GHz ARM®
- Pbfree Code :
- No
- Terminal Pitch :
- 1mm
- ECCN Code :
- 3A001.A.3
- RoHS Status :
- Non-RoHS Compliant
- Supply Voltage :
- 1V
- Number of Timers/Counters :
- 20
- Number of UART Channels :
- 2
- JESD-30 Code :
- S-PBGA-B1517
- Format :
- Floating Point
- Frequency :
- 1.4GHz
- Length :
- 38mm
- Max Supply Voltage :
- 1.1V
- Operating Temperature :
- 0°C~85°C TC
- Memory Size :
- 4MB
- Mounting Type :
- Surface Mount
- RAM Size :
- 32kB
- Non-Volatile Memory :
- ROM (384kB)
- Voltage - Core :
- Variable
- Packaging :
- Tray
- Height :
- 800μm
- Voltage - I/O :
- 0.85V 1.0V 1.35V 1.5V 1.8V 3.3V
- Min Supply Voltage :
- 800mV
- On Chip Data RAM :
- 8.375MB
- Type :
- DSP+ARM®
- Low Power Mode :
- yes
- Base Part Number :
- 66AK2H06
- Terminal Form :
- Ball
- Core Architecture :
- ARM
- Package / Case :
- 1517-BBGA, FCBGA
- Interface :
- EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0
- Terminal Position :
- BOTTOM
- Datasheets
- X66AK2H06AAW24

DSP Texas Instruments X66AK2H06AAW24 Overview
The DSP Texas Instruments X66AK2H06AAW24 is an advanced digital signal processor (DSP) designed for high-performance applications requiring sophisticated signal computation and system control. Engineered by Texas Instruments, a leader in semiconductor design and manufacturing, this IC integrates powerful ARM architecture with flexible DSP capabilities, making it an ideal choice for developers looking to push the boundaries of audio, video, and signal processing technologies. Its compact BGA packaging ensures a minimal footprint while providing robust connectivity options for complex electronic systems.
X66AK2H06AAW24 Features
This high-performance IC boasts a range of features that enhance its utility in demanding applications. Key features include its high-speed ARM processor, extensive DSP functionalities, and a BGA package that simplifies board-level integration. With its advanced power management systems, it offers efficiency alongside performance, suitable for both portable and stationary applications that require reliable, continuous operation.
X66AK2H06AAW24 Applications
- Audio Processing Systems: Utilized in high-definition audio equipment, where it processes complex audio signals to deliver crisp, clear sound output.
- Video Processing Equipment: Employs its DSP capabilities to manage and enhance video feeds in real-time, ideal for surveillance systems and advanced video conferencing solutions.
- Telecommunications: Acts as a core processor in telecommunication infrastructure, managing signal integrity and data flow across networks.
- Medical Imaging Devices: Applied in devices like ultrasound and MRI machines, where its processing power helps in rendering high-resolution images rapidly.
- Industrial Control Systems: Helps in the precise control and monitoring of industrial machinery, enhancing automation and efficiency in manufacturing processes.
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