X66AK2H12AAAW24
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- Mfr.Part #
- X66AK2H12AAAW24
- Manufacturer
- Texas Instruments
- Package / Case
- 1517-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC DSP ARM SOC BGA
- Stock
- 3,721
- In Stock ：
- 3,721
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- Manufacturer :
- Texas Instruments
- Product Category :
- DSP (Digital Signal Processors)
- Non-Volatile Memory :
- ROM (384kB)
- Length :
- 40mm
- Core Architecture :
- ARM
- Packaging :
- Tray
- Low Power Mode :
- yes
- On Chip Data RAM :
- 12.75MB
- Base Part Number :
- 66AK2H12
- Number of Timers/Counters :
- 20
- External Data Bus Width :
- 16
- Address Bus Width :
- 24
- Terminal Pitch :
- 1mm
- Width :
- 40mm
- Mount :
- Surface Mount
- Number of Pins :
- 1517
- Memory Type :
- SRAM
- Interface :
- EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0
- Integrated Cache :
- yes
- Supply Voltage :
- 1V
- Format :
- Floating Point
- Package / Case :
- 1517-BBGA, FCBGA
- RoHS Status :
- Non-RoHS Compliant
- Operating Temperature :
- 0°C~85°C TC
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- RAM Size :
- 512kB
- Pbfree Code :
- No
- Terminal Form :
- Ball
- Lead Free :
- Contains Lead
- Voltage - I/O :
- 0.85V 1.0V 1.35V 1.5V 1.8V 3.3V
- Series :
- 66AK2Hx KeyStone Multicore
- Type :
- DSP+ARM®
- Mounting Type :
- Surface Mount
- Height Seated (Max) :
- 3.75mm
- Voltage - Core :
- Variable
- Speed :
- 1400 MHz
- Frequency :
- 1.4GHz
- Boundary Scan :
- yes
- Min Supply Voltage :
- 902mV
- Clock Rate :
- 1.2GHz DSP, 1.4GHz ARM®
- Terminal Position :
- BOTTOM
- Datasheets
- X66AK2H12AAAW24
DSP Texas Instruments X66AK2H12AAAW24 Overview
The DSP Texas Instruments X66AK2H12AAAW24 is a cutting-edge integrated circuit designed for high-performance digital signal processing. Engineered by Texas Instruments, this IC leverages the powerful ARM architecture to provide a robust solution for complex signal processing tasks. This product is ideal for applications requiring efficient and fast processing capabilities, such as audio processing, telecommunications, and real-time analytics. Its BGA (Ball Grid Array) packaging ensures reliable electrical connections and optimal heat dissipation, making it a dependable choice for advanced embedded systems.
X66AK2H12AAAW24 Features
The X66AK2H12AAAW24 boasts several features that make it a superior choice for demanding applications. It integrates advanced DSP capabilities with an ARM SOC framework, facilitating not only high-speed data processing but also efficient power management. The BGA packaging enhances the thermal and mechanical performance, allowing for denser circuitry and improved reliability in harsh environments.
X66AK2H12AAAW24 Applications
- Audio Processing Systems: Utilizes its DSP capabilities to manage complex audio signal processing tasks, enabling clearer sound quality and advanced audio features for consumer electronics and professional audio equipment.
- Telecommunications Equipment: Employs high-speed signal processing to handle data transmission and reception efficiently, crucial for base stations and network interfaces in communication infrastructure.
- Real-time Analytics: Supports analytics applications by processing large streams of data in real time, ideal for use in financial systems, security systems, and smart city technologies.
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