X66AK2H12AAAW24

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Mfr.Part #
X66AK2H12AAAW24
Manufacturer
Texas Instruments
Package / Case
1517-BBGA, FCBGA
Datasheet
Download
Description
IC DSP ARM SOC BGA
Stock
3,721
In Stock :
3,721

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Manufacturer :
Texas Instruments
Product Category :
DSP (Digital Signal Processors)
Voltage - I/O :
0.85V 1.0V 1.35V 1.5V 1.8V 3.3V
Terminal Form :
Ball
Low Power Mode :
yes
Terminal Pitch :
1mm
Non-Volatile Memory :
ROM (384kB)
RoHS Status :
Non-RoHS Compliant
Series :
66AK2Hx KeyStone Multicore
Height Seated (Max) :
3.75mm
Memory Type :
SRAM
Format :
Floating Point
Core Architecture :
ARM
Width :
40mm
Number of Timers/Counters :
20
RAM Size :
512kB
Min Supply Voltage :
902mV
Terminal Position :
BOTTOM
Speed :
1400 MHz
Number of Pins :
1517
Frequency :
1.4GHz
Boundary Scan :
yes
Type :
DSP+ARM®
Packaging :
Tray
External Data Bus Width :
16
On Chip Data RAM :
12.75MB
Supply Voltage :
1V
Mounting Type :
Surface Mount
Mount :
Surface Mount
Base Part Number :
66AK2H12
Package / Case :
1517-BBGA, FCBGA
Integrated Cache :
yes
Lead Free :
Contains Lead
Voltage - Core :
Variable
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Operating Temperature :
0°C~85°C TC
Pbfree Code :
No
Clock Rate :
1.2GHz DSP, 1.4GHz ARM®
Interface :
EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0
Length :
40mm
Address Bus Width :
24
Introducing DSP (Digital Signal Processors) Texas Instruments X66AK2H12AAAW24 from Chip IC,where excellence meets affordability. This product stands out with its Number of Pins:1517, Type:DSP+ARM®, Mounting Type:Surface Mount, Base Part Number:66AK2H12, Package / Case:1517-BBGA, FCBGA, Operating Temperature:0°C~85°C TC, X66AK2H12AAAW24 pinout, X66AK2H12AAAW24 datasheet PDF, X66AK2H12AAAW24 amp .Beyond DSP (Digital Signal Processors) Texas Instruments X66AK2H12AAAW24 ,we also offer TMS320VC5416PGE160, TMS320C6713BZDP300, ADSP-21369KBPZ-3A, Our vast inventory has you covered. Contact us now for immediate solutions.

Texas Instruments X66AK2H12AAAW24


DSP Texas Instruments X66AK2H12AAAW24 Overview

The DSP Texas Instruments X66AK2H12AAAW24 is a cutting-edge integrated circuit designed for high-performance digital signal processing. Engineered by Texas Instruments, this IC leverages the powerful ARM architecture to provide a robust solution for complex signal processing tasks. This product is ideal for applications requiring efficient and fast processing capabilities, such as audio processing, telecommunications, and real-time analytics. Its BGA (Ball Grid Array) packaging ensures reliable electrical connections and optimal heat dissipation, making it a dependable choice for advanced embedded systems.

X66AK2H12AAAW24 Features

The X66AK2H12AAAW24 boasts several features that make it a superior choice for demanding applications. It integrates advanced DSP capabilities with an ARM SOC framework, facilitating not only high-speed data processing but also efficient power management. The BGA packaging enhances the thermal and mechanical performance, allowing for denser circuitry and improved reliability in harsh environments.

X66AK2H12AAAW24 Applications

  • Audio Processing Systems: Utilizes its DSP capabilities to manage complex audio signal processing tasks, enabling clearer sound quality and advanced audio features for consumer electronics and professional audio equipment.
  • Telecommunications Equipment: Employs high-speed signal processing to handle data transmission and reception efficiently, crucial for base stations and network interfaces in communication infrastructure.
  • Real-time Analytics: Supports analytics applications by processing large streams of data in real time, ideal for use in financial systems, security systems, and smart city technologies.
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