X66AK2H12AAW2
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- Mfr.Part #
- X66AK2H12AAW2
- Manufacturer
- Texas Instruments
- Package / Case
- 1517-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC DSP ARM SOC BGA
- Stock
- 48,456
- In Stock ：
- 48,456
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- Manufacturer :
- Texas Instruments
- Product Category :
- DSP (Digital Signal Processors)
- Mounting Type :
- Surface Mount
- Terminal Pitch :
- 1mm
- Terminal Position :
- BOTTOM
- Package / Case :
- 1517-BBGA, FCBGA
- Supply Voltage-Min (Vsup) :
- 0.95V
- Frequency :
- 1.2GHz
- Base Part Number :
- 66AK2H12
- Width :
- 40mm
- Voltage - I/O :
- 0.85V 1.0V 1.35V 1.5V 1.8V 3.3V
- JESD-30 Code :
- S-PBGA-B1517
- Length :
- 40mm
- Terminal Form :
- Ball
- Format :
- Floating Point
- RoHS Status :
- Non-RoHS Compliant
- Number of UART Channels :
- 2
- Mount :
- Surface Mount
- Interface :
- EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0
- Type :
- DSP+ARM®
- Operating Temperature :
- 0°C~85°C TC
- Series :
- 66AK2Hx KeyStone Multicore
- Supply Voltage :
- 1V
- Height Seated (Max) :
- 3.75mm
- On Chip Data RAM :
- 12.75MB
- Supply Voltage-Max (Vsup) :
- 1.05V
- ECCN Code :
- 3A001.A.3
- Low Power Mode :
- yes
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- External Data Bus Width :
- 16
- Packaging :
- Tray
- Voltage - Core :
- Variable
- Boundary Scan :
- yes
- Address Bus Width :
- 24
- Pbfree Code :
- No
- Non-Volatile Memory :
- ROM (384kB)
- Integrated Cache :
- yes
- Datasheets
- X66AK2H12AAW2
DSP Texas Instruments X66AK2H12AAW2 Overview
The Texas Instruments X66AK2H12AAW2 DSP (Digital Signal Processor) is an advanced system-on-chip (SoC) that integrates a robust ARM core with extensive digital signal processing capabilities. This product is tailored to meet the demanding requirements of high-performance signal processing applications. The X66AK2H12AAW2 is designed to offer a balanced combination of efficiency and power, making it an ideal choice for developers looking to optimize multimedia and communication systems. Incorporating this DSP Texas Instruments X66AK2H12AAW2 in your designs ensures a scalable solution that supports a wide range of functionalities, from basic signal manipulation to complex algorithm computations, all within a compact BGA package.
X66AK2H12AAW2 Features
This DSP features a high-speed ARM processor core, coupled with a powerful digital signal processing unit that allows it to handle multiple tasks simultaneously and efficiently. Its integration in a BGA package ensures minimal footprint on system boards, while providing ample pinouts for flexible connectivity. The X66AK2H12AAW2 also supports various I/O options and has low power consumption, making it suitable for portable devices.
X66AK2H12AAW2 Applications
- Mobile Devices: Utilized in smartphones and tablets to enhance audio and video capabilities through advanced signal processing algorithms.
- Audio Processing Equipment: Applied in audio interfaces, mixers, and sound processors, improving sound quality and effects rendering.
- Automotive Systems: Used in car entertainment and navigation systems to process and streamline audio and video outputs for better user experience.
- Telecommunications: Integrates into telecommunication infrastructure to manage signal processing tasks efficiently, enhancing data transmission and reception.
- Industrial Systems: Employs in control systems for real-time signal processing tasks that require high reliability and precision.
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