FQB10N50CFTM-WS
- Mfr.Part #
- FQB10N50CFTM-WS
- Manufacturer
- onsemi
- Package / Case
- TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
- Datasheet
- Download
- Description
- MOSFET N-CH 500V 10A D2PAK
- Stock
- 23,234
- In Stock :
- 23,234
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- Manufacturer :
- onsemi
- Product Category :
- Transistors - FETs, MOSFETs - Single
- Pbfree Code :
- yes
- Power Dissipation :
- 143W
- Pulsed Drain Current-Max (IDM) :
- 40A
- Avalanche Energy Rating (Eas) :
- 825 mJ
- Lifecycle Status :
- ACTIVE (Last Updated: 1 week ago)
- Vgs(th) (Max) @ Id :
- 4V @ 250µA
- Terminal Form :
- Gull wing
- Transistor Element Material :
- SILICON
- Continuous Drain Current (ID) :
- 10A
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Element Configuration :
- Single
- Package / Case :
- TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
- JESD-30 Code :
- R-PSSO-G2
- Number of Elements :
- 1
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Power Dissipation-Max :
- 143W Tc
- Factory Lead Time :
- 4 Weeks
- Current - Continuous Drain (Id) @ 25°C :
- 10A Tc
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Packaging :
- Tape and Reel (TR)
- Case Connection :
- DRAIN
- Rds On (Max) @ Id, Vgs :
- 610m Ω @ 5A, 10V
- Gate to Source Voltage (Vgs) :
- 30V
- Operating Temperature :
- -55°C~150°C TJ
- Reach Compliance Code :
- not_compliant
- RoHS Status :
- ROHS3 Compliant
- DS Breakdown Voltage-Min :
- 500V
- Mounting Type :
- Surface Mount
- Number of Terminations :
- 2
- Gate Charge (Qg) (Max) @ Vgs :
- 60nC @ 10V
- Vgs (Max) :
- ±30V
- Number of Pins :
- 3
- Series :
- FRFET®, QFET™
- Drive Voltage (Max Rds On,Min Rds On) :
- 10V
- Operating Mode :
- ENHANCEMENT MODE
- Mount :
- Surface Mount
- FET Type :
- N-Channel
- Transistor Application :
- SWITCHING
- Drain to Source Voltage (Vdss) :
- 500V
- Input Capacitance (Ciss) (Max) @ Vds :
- 2210pF @ 25V
- Weight :
- 1.31247g
- Datasheets
- FQB10N50CFTM-WS

N-Channel Tape & Reel (TR) 610m Ω @ 5A, 10V ±30V 2210pF @ 25V 60nC @ 10V 500V TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
FQB10N50CFTM-WS Overview
When a voltage exceeds breakdown voltage of a MOSFET, breakdown phenomena occurs and current flows. It's called “Avalanche break down”, and the energy applied to the MOSFET is called avalanche energy, and the avalanche energy rating (Eas) is 825 mJ.The input capacitance parameter, CI, is defined as the capacitance between the input terminals of an op amp with either input grounded, and this device's maximal input capacitance is 2210pF @ 25V.The drain current is the maximum continuous current the device can conduct, and the continuous drain current (ID) of this device is 10A. IDM is the maximum rated peak drain current for a power MOSFET, and its maximal pulsed drain current is 40A.The gate-source voltage, VGS, of a FET transistor is the voltage that falls across the gate-source terminal of the transistor and its voltage can be 30V.Single MOSFETs transistor is recommended that the DS breakdown voltage be kept above 500V in order to maintain normal operation.Operating this transistor requires a 500V drain to source voltage (Vdss).By using drive voltage (10V), this device helps reduce its overall power consumption.
FQB10N50CFTM-WS Features
the avalanche energy rating (Eas) is 825 mJ
a continuous drain current (ID) of 10A
based on its rated peak drain current 40A.
a 500V drain to source voltage (Vdss)
FQB10N50CFTM-WS Applications
There are a lot of ON Semiconductor
FQB10N50CFTM-WS applications of single MOSFETs transistors.
- LCD/LED TV
- Consumer Appliances
- Lighting
- Uninterruptible Power Supply
- AC-DC Power Supply
- Synchronous Rectification for ATX 1 Server I Telecom PSU
- Motor drives and Uninterruptible Power Supplies
- Micro Solar Inverter
- DC/DC converters
- Power Tools
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