FDP26N40
- Mfr.Part #
- FDP26N40
- Manufacturer
- onsemi
- Package / Case
- TO-220-3
- Datasheet
- Download
- Description
- MOSFET N-CH 400V 26A TO220-3
- Stock
- 13,478
- In Stock :
- 13,478
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- Manufacturer :
- onsemi
- Product Category :
- Transistors - FETs, MOSFETs - Single
- Packaging :
- Tube
- Lifecycle Status :
- ACTIVE (Last Updated: 3 days ago)
- Lead Free :
- Lead Free
- Element Configuration :
- Single
- Turn On Delay Time :
- 45 ns
- Number of Elements :
- 1
- Drain to Source Breakdown Voltage :
- 400V
- Power Dissipation-Max :
- 265W Tc
- Operating Temperature :
- -55°C~150°C TJ
- Additional Feature :
- AVALANCHE RATED
- REACH SVHC :
- No SVHC
- Transistor Application :
- SWITCHING
- Height :
- 15.38mm
- Gate to Source Voltage (Vgs) :
- 30V
- Drive Voltage (Max Rds On,Min Rds On) :
- 10V
- Weight :
- 1.8g
- Power Dissipation :
- 265W
- JEDEC-95 Code :
- TO-220AB
- Width :
- 4.7mm
- Length :
- 10.1mm
- Vgs (Max) :
- ±30V
- Factory Lead Time :
- 5 Weeks
- FET Type :
- N-Channel
- Vgs(th) (Max) @ Id :
- 5V @ 250μA
- Series :
- UniFET™
- Rise Time :
- 100ns
- Continuous Drain Current (ID) :
- 26A
- Number of Terminations :
- 3
- RoHS Status :
- ROHS3 Compliant
- Turn-Off Delay Time :
- 115 ns
- Contact Plating :
- Tin
- Package / Case :
- TO-220-3
- Current - Continuous Drain (Id) @ 25°C :
- 26A Tc
- Operating Mode :
- ENHANCEMENT MODE
- Gate Charge (Qg) (Max) @ Vgs :
- 60nC @ 10V
- Pbfree Code :
- yes
- Transistor Element Material :
- SILICON
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Number of Pins :
- 3
- Published :
- 2013
- ECCN Code :
- EAR99
- Resistance :
- 160mOhm
- Mount :
- Through Hole
- Input Capacitance (Ciss) (Max) @ Vds :
- 3185pF @ 25V
- Radiation Hardening :
- No
- Mounting Type :
- Through Hole
- Rds On (Max) @ Id, Vgs :
- 160m Ω @ 13A, 10V
- Fall Time (Typ) :
- 66 ns
- JESD-609 Code :
- e3
- Datasheets
- FDP26N40
FDP26N40 Documents

N-Channel Tube 160m Ω @ 13A, 10V ±30V 3185pF @ 25V 60nC @ 10V TO-220-3
FDP26N40 IC is a type of UniFET? N-channel MOSFET with high voltage, which is able to provide better switching performance, higher avanlanche engergy strength, and is especially tailored to minimize on-state resistance based on planar stripe and DMOS technology. Moreover, it is able to withstand surge stresses in excess of 2000V HBM based on the internal gate-source ESD diodes. FDP26N40 is designed with excellent reliability in its performance, including the reduction in voltage spikes and overshoot, reduction in junction capacitance and reverse recovery charge, as well as elimination of additional external components, thus ensuring the system features long runtimes. It can be integrated into a variety of industrial-standard and thermally enhanced packages based on advanced silicon technology.
FDP26N40 Features
Planar stripe and DMOS technology
Better switching performance
High avanlanche energy strength
Improved dv/dt capability
Capacity to reduce on-state resistance
Voltage across the gate and source of 400V
Operating and storage temperature range of -55 to +150°C
Mounted in the way of through hole
Available in the TO-220-3 package
FDP26N40 Applications
Power factor correction (PFC)
Flat panel display (FPD) TV power
ATX (advanced technology extended)
Electronic lamp ballasts
Uninterruptible power supplies
AC-DC power supplies
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