FDG316P

Manufacturer :

onsemi

Product Category :

Transistors - FETs, MOSFETs - Single

Current - Continuous Drain (Id) @ 25°C :

1.6A Ta

Operating Temperature :

-55°C~150°C TJ

FET Type :

P-Channel

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Weight :

28mg

Number of Pins :

6

Height :

1mm

Packaging :

Tape and Reel (TR)

Element Configuration :

Single

ECCN Code :

EAR99

Width :

1.25mm

REACH SVHC :

No SVHC

RoHS Status :

ROHS3 Compliant

Current Rating :

1.6A

Terminal Form :

Gull wing

Fall Time (Typ) :

9 ns

Transistor Element Material :

SILICON

Vgs(th) (Max) @ Id :

3V @ 250µA

Rise Time :

9ns

Drain to Source Breakdown Voltage :

-30V

Published :

2000

Number of Terminations :

6

Length :

2mm

Gate to Source Voltage (Vgs) :

20V

Factory Lead Time :

10 Weeks

Resistance :

190mOhm

Turn-Off Delay Time :

14 ns

Mount :

Surface Mount

JESD-609 Code :

e3

Turn On Delay Time :

8 ns

Package / Case :

6-TSSOP, SC-88, SOT-363

Operating Mode :

ENHANCEMENT MODE

Rds On (Max) @ Id, Vgs :

190m Ω @ 1.6A, 10V

Input Capacitance (Ciss) (Max) @ Vds :

165pF @ 15V

Transistor Application :

SWITCHING

Pbfree Code :

yes

Continuous Drain Current (ID) :

1.6A

Terminal Position :

Dual

Vgs (Max) :

±20V

Threshold Voltage :

-1.6V

Power Dissipation-Max :

750mW Ta

Radiation Hardening :

No

Lead Free :

Lead Free

Gate Charge (Qg) (Max) @ Vgs :

5nC @ 10V

Voltage - Rated DC :

30V

Drive Voltage (Max Rds On,Min Rds On) :

4.5V 10V

Series :

PowerTrench®

Power Dissipation :

750mW

Number of Elements :

1

Lifecycle Status :

ACTIVE (Last Updated: 2 days ago)

Mounting Type :

Surface Mount

Contact Plating :

Tin