10AX115S4F45I3SGES
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- Mfr.Part #
- 10AX115S4F45I3SGES
- Manufacturer
- Altera (Intel)
- Package / Case
- 1932-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 624 I/O 1932FBGA
- Stock
- 24,615
- In Stock ：
- 24,615
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- Manufacturer :
- Altera (Intel)
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Height Seated (Max) :
- 3.65mm
- Number of Logic Elements/Cells :
- 1150000
- Surface Mount :
- yes
- Voltage - Supply :
- 0.87V~0.93V
- Mounting Type :
- Surface Mount
- Number of I/O :
- 624
- JESD-30 Code :
- S-PBGA-B1932
- HTS Code :
- 8542.39.00.01
- Operating Temperature :
- -40°C~100°C TJ
- Series :
- Arria 10 GX
- Total RAM Bits :
- 68857856
- Terminal Position :
- BOTTOM
- Terminal Pitch :
- 1mm
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- RoHS Status :
- RoHS Compliant
- Number of LABs/CLBs :
- 427200
- Length :
- 45mm
- Terminal Form :
- Ball
- Packaging :
- Tray
- Width :
- 45mm
- Package / Case :
- 1932-BBGA, FCBGA
- Supply Voltage :
- 0.9V
- Datasheets
- 10AX115S4F45I3SGES
FPGAs (Field Programmable Gate Array) Altera (Intel) 10AX115S4F45I3SGES Overview
Introducing the robust and highly capable FPGAs (Field Programmable Gate Array) Altera (Intel) 10AX115S4F45I3SGES, a cutting-edge FPGA designed by Altera, now part of Intel's premier lineup. This IC FPGA is crafted to meet the advanced needs of modern digital applications, featuring a high I/O interface with 624 inputs/outputs packed into a dense 1932FBGA package. The device's flexible architecture and enhanced logic utilization significantly boost its performance, making it ideal for high-speed and complex computing tasks. Its adaptability ensures it fits into various sectors, providing both efficiency and scalability.
10AX115S4F45I3SGES Features
The 10AX115S4F45I3SGES FPGA offers a comprehensive suite of features that enhance its applicability in high-performance environments. Key attributes include a large number of I/O pins, which are crucial for complex, multi-faceted applications requiring numerous simultaneous connections. The 1932FBGA packaging not only allows for a compact footprint but also ensures robust physical protection and efficient heat dissipation, critical for maintaining reliability and performance under demanding conditions.
10AX115S4F45I3SGES Applications
- Data Centers: Utilized for managing vast arrays of data processing tasks, ensuring speed and reliability for cloud computing services.
- Telecommunications: Essential in handling high-speed signal processing operations that are fundamental for modern telecommunication infrastructures.
- Automotive: Applied in advanced driver-assistance systems (ADAS) to process multiple inputs from various sensors, enhancing vehicle safety and automation.
- Industrial Automation: Serves as the backbone for controlling machinery and processes, increasing efficiency and reducing human intervention in harsh environments.
- Medical Devices: Critical in the operation of diagnostic and imaging equipment, ensuring fast and accurate data processing for better patient outcomes.
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