10AX016E3F27I1SG

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Mfr.Part #
10AX016E3F27I1SG
Manufacturer
Altera (Intel)
Package / Case
672-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 240 I/O 672FBGA
Stock
45,146
In Stock :
45,146

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Terminal Pitch :
1mm
RoHS Status :
RoHS Compliant
Number of I/O :
240
Length :
27mm
Number of Terminations :
672
Power Supplies :
0.9V
Number of Logic Elements/Cells :
160000
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Surface Mount :
yes
Terminal Position :
BOTTOM
Supply Voltage :
0.9V
Number of Inputs :
240
Number of Outputs :
240
Series :
Arria 10 GX
Height Seated (Max) :
3.25mm
Qualification Status :
Not Qualified
Package / Case :
672-BBGA, FCBGA
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Operating Temperature :
-40°C~100°C TJ
Number of LABs/CLBs :
61510
Packaging :
Tray
Width :
27mm
JESD-30 Code :
S-PBGA-B672
HTS Code :
8542.39.00.01
Mounting Type :
Surface Mount
Voltage - Supply :
0.87V~0.98V
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Terminal Form :
Ball
Total RAM Bits :
10086400
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Datasheets
10AX016E3F27I1SG
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 10AX016E3F27I1SG from Chip IC,where excellence meets affordability. This product stands out with its Number of Terminations:672, Package / Case:672-BBGA, FCBGA, Operating Temperature:-40°C~100°C TJ, Mounting Type:Surface Mount, 10AX016E3F27I1SG pinout, 10AX016E3F27I1SG datasheet PDF, 10AX016E3F27I1SG amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 10AX016E3F27I1SG ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 10AX016E3F27I1SG


FPGAs Altera (Intel) 10AX016E3F27I1SG Overview

The FPGAs Altera (Intel) 10AX016E3F27I1SG is a highly versatile, high-performance FPGA (Field Programmable Gate Array) designed by Intel's Altera division. This component features a robust 672-ball fine pitch BGA (FBGA) package, providing substantial I/O capabilities with 240 programmable I/O pins suitable for a wide range of digital and mixed-signal applications. Its design targets demanding applications that require rapid, flexible deployment of algorithms with varying complexities. Perfect for industrial, automotive, and communication sectors, the FPGA ensures reliability and adaptability in complex digital environments. The integration of this device into systems greatly enhances performance, flexibility, and scalability, making it a top choice for engineers and developers looking for efficient solutions in programmable logic.

10AX016E3F27I1SG Features

This FPGA offers a powerful combination of features that make it ideal for a wide range of applications. Key features include the large number of I/O ports, the advanced 28 nm technology, and support for integrated DSP blocks. It also supports PCIe Gen2 x4 interfaces and advanced memory integration. These features provide the necessary tools for developing advanced digital computing systems that require high-speed data processing and versatile connectivity options.

10AX016E3F27I1SG Applications

  • Data Centers: Utilizes high I/O bandwidth and processing capabilities to manage and accelerate compute-intensive tasks, improving overall efficiency and performance.
  • Automotive Applications: Supports advanced driver-assistance systems (ADAS) by processing inputs from multiple sensors and cameras, ensuring real-time response and reliability.
  • Telecommunications: Helps in the deployment of complex communication protocols and signal processing algorithms necessary for 5G and other high-speed communication technologies.
  • Industrial Automation: Facilitates the control and management of machinery and processes through customizable logic blocks, improving operational efficiency and adaptability.
  • Consumer Electronics: Applied in devices requiring high-speed video and image processing, enhancing user experiences with rapid data handling capabilities.
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