10AX115S4F45I3SG

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Mfr.Part #
10AX115S4F45I3SG
Manufacturer
Altera (Intel)
Package / Case
1932-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 624 I/O 1932FCBGA
Stock
44,548
In Stock :
44,548

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Supply Voltage :
0.9V
Terminal Form :
Ball
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
JESD-30 Code :
S-PBGA-B1932
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Voltage - Supply :
0.87V~0.93V
Qualification Status :
Not Qualified
RoHS Status :
RoHS Compliant
HTS Code :
8542.39.00.01
Number of LABs/CLBs :
427200
Mounting Type :
Surface Mount
Package / Case :
1932-BBGA, FCBGA
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Number of I/O :
624
Total RAM Bits :
68857856
Packaging :
Tray
Operating Temperature :
-40°C~100°C TJ
Power Supplies :
0.9V
Number of Outputs :
624
Surface Mount :
yes
Length :
45mm
Terminal Pitch :
1mm
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Factory Lead Time :
8 Weeks
Width :
45mm
Series :
Arria 10 GX
Number of Logic Elements/Cells :
1150000
Number of Inputs :
624
Terminal Position :
BOTTOM
Height Seated (Max) :
3.65mm
Datasheets
10AX115S4F45I3SG
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 10AX115S4F45I3SG from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Package / Case:1932-BBGA, FCBGA, Operating Temperature:-40°C~100°C TJ, 10AX115S4F45I3SG pinout, 10AX115S4F45I3SG datasheet PDF, 10AX115S4F45I3SG amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 10AX115S4F45I3SG ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 10AX115S4F45I3SG


FPGAs (Field Programmable Gate Array) Altera (Intel) 10AX115S4F45I3SG Overview

The FPGAs (Field Programmable Gate Array) Altera (Intel) 10AX115S4F45I3SG is a high-performance integrated circuit developed by Intel's Altera division. This FPGA is designed to meet the demanding requirements of high-speed and complex digital processing tasks. Its 1932-pin FCBGA (Flip Chip Ball Grid Array) packaging ensures robust physical connectivity and efficient heat dissipation, making it ideal for advanced industrial applications. The 10AX115S4F45I3SG provides an extensive I/O interface with 624 programmable I/O pins, allowing for flexible and scalable integration into multiple electronic systems. This product is tailored for developers looking to push the boundaries of technology in fields such as data processing, telecommunications, and high-speed computing.

10AX115S4F45I3SG Features

This FPGA model boasts several features that make it a versatile choice for system integration:

  • High I/O Pin Count: With 624 I/O pins, this device offers extensive connectivity options for a wide range of applications.
  • Advanced Packaging: Utilizing a 1932FCBGA package, it provides improved thermal management and reliability for high-density circuit designs.
  • Reprogrammable Technology: Offers the flexibility to be programmed in the field for real-time system updates and enhancements.

10AX115S4F45I3SG Applications

  • Data Centers: Utilized in server infrastructure to enhance data processing capabilities and manage large-scale operations efficiently.
  • Telecommunications: Implements signal processing tasks and supports high-speed data transmission and reception in communication equipment.
  • Automotive: Integrated into driver assistance systems to process real-time data from sensors and cameras, improving vehicle safety and performance.
  • Industrial Automation: Applied in control systems for machinery and production lines, increasing automation reliability and precision.
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