10AX115R3F40E2LG
- Mfr.Part #
- 10AX115R3F40E2LG
- Manufacturer
- Altera (Intel)
- Package / Case
- 1517-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 342 I/O 1517FBGA
- Stock
- 8,123
- In Stock :
- 8,123
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- Manufacturer :
- Altera (Intel)
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Terminal Form :
- Ball
- Operating Temperature :
- 0°C~100°C TJ
- RoHS Status :
- RoHS Compliant
- Number of LABs/CLBs :
- 427200
- Total RAM Bits :
- 68857856
- JESD-30 Code :
- S-PBGA-B1517
- Number of Inputs :
- 342
- Height Seated (Max) :
- 3.5mm
- Packaging :
- Tray
- Number of Outputs :
- 342
- Number of Logic Elements/Cells :
- 1150000
- Width :
- 40mm
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Mounting Type :
- Surface Mount
- Length :
- 40mm
- Package / Case :
- 1517-BBGA, FCBGA
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Voltage - Supply :
- 0.87V~0.93V
- Number of I/O :
- 342
- Terminal Position :
- BOTTOM
- Terminal Pitch :
- 1mm
- Power Supplies :
- 0.9V
- Surface Mount :
- yes
- Qualification Status :
- Not Qualified
- Series :
- Arria 10 GX
- HTS Code :
- 8542.39.00.01
- Supply Voltage :
- 0.9V
- Datasheets
- 10AX115R3F40E2LG

FPGAs Altera (Intel) 10AX115R3F40E2LG Overview
The FPGAs Altera (Intel) 10AX115R3F40E2LG is a high-performance integrated circuit developed by Intel, formerly known as Altera. This FPGA is designed to meet the demanding requirements of high-throughput systems and complex digital logic circuits. Built on Intel's advanced technology, the 10AX115R3F40E2LG offers a flexible, programmable architecture that allows designers to optimize their systems for specific applications, ensuring both efficiency and scalability. Its large array of 1517 FBGA pins makes it an ideal choice for developers looking for robust connectivity options in their hardware designs.
10AX115R3F40E2LG Features
- High I/O Count: Features 342 programmable I/O pins allowing for versatile interfacing with a wide range of peripherals and other ICs.
- Large FBGA Package: Enclosed in a 1517-pin Fine Ball Grid Array (FBGA) package, providing a compact form factor with a high level of integration.
- Intel's Advanced Technology: Benefits from the cutting-edge technology enhancements by Intel, ensuring superior performance and reliability.
10AX115R3F40E2LG Applications
- Data Centers: Utilized in server infrastructure to manage complex data processing tasks efficiently. The high I/O count allows seamless integration into existing architectures.
- Communications Equipment: Ideal for telecommunications infrastructure where high data throughput and processing capabilities are required.
- Automotive Systems: Can be embedded in automotive electronics for managing advanced driver-assistance systems (ADAS), enhancing vehicle intelligence and safety.
- Video Processing: Supports high-resolution video processing for broadcasting and multimedia applications, thanks to its robust data handling capabilities.
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