10AX115N3F40I3SGES

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Mfr.Part #
10AX115N3F40I3SGES
Manufacturer
Altera (Intel)
Package / Case
1517-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 600 I/O 1517FCBGA
Stock
14,097
In Stock :
14,097

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Supplier Device Package :
1517-FCBGA (40x40)
Number of LABs/CLBs :
427200
Voltage - Supply :
0.87V~0.93V
Package / Case :
1517-BBGA, FCBGA
Total RAM Bits :
68857856
Series :
Arria 10 GX
Operating Temperature :
-40°C~100°C TJ
Packaging :
Tray
Number of I/O :
600
Number of Logic Elements/Cells :
1150000
Mounting Type :
Surface Mount
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 10AX115N3F40I3SGES from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:1517-BBGA, FCBGA, Operating Temperature:-40°C~100°C TJ, Mounting Type:Surface Mount, 10AX115N3F40I3SGES pinout, 10AX115N3F40I3SGES datasheet PDF, 10AX115N3F40I3SGES amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 10AX115N3F40I3SGES ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 10AX115N3F40I3SGES


FPGAs (Field Programmable Gate Array) Altera (Intel) 10AX115N3F40I3SGES Overview

The Altera (Intel) 10AX115N3F40I3SGES IC FPGA represents a pinnacle in the field of programmable logic solutions, engineered to meet the demanding requirements of high-speed and high-density applications. Designed for versatility, this FPGA features a substantial interface capacity with 600 I/O pins housed within a 1517FCBGA package, facilitating robust, scalable architectures for complex digital systems. The incorporation of advanced technology from Altera (Intel) ensures optimal performance and reliability, making the FPGAs (Field Programmable Gate Array) Altera (Intel) 10AX115N3F40I3SGES a prime choice for developers looking to push the boundaries of innovation while maintaining efficiency and precision in their designs.

10AX115N3F40I3SGES Features

This FPGA unit is designed to support a variety of system requirements with features that include a high I/O count and a compact 1517-pin flip-chip ball grid array (FCBGA) package. This combination ensures a high level of integration and connectivity, making it suitable for handling complex, multi-functional devices in information technology and telecommunications.

10AX115N3F40I3SGES Applications

  • Data Centers: Utilized in server farms and cloud storage facilities to accelerate data processing and reduce latency.
  • Telecommunications: Integral to infrastructure for both wired and wireless communication networks, enhancing bandwidth and reducing signal processing time.
  • Automotive Technology: Employed in driver assistance systems and autonomous driving technologies to process real-time data from vehicle sensors.
  • Industrial Automation: Used in control systems for real-time operational management and efficiency improvements in manufacturing processes.
  • Medical Devices: Critical for diagnostic and imaging equipment, providing fast, reliable processing capabilities that assist in patient care and treatment accuracy.
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