10AX115N3F40E2LG
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- Mfr.Part #
- 10AX115N3F40E2LG
- Manufacturer
- Altera (Intel)
- Package / Case
- 1517-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 600 I/O 1517FCBGA
- Stock
- 9,827
- In Stock ：
- 9,827
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- Manufacturer :
- Altera (Intel)
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Surface Mount :
- yes
- Width :
- 40mm
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Terminal Position :
- BOTTOM
- Terminal Pitch :
- 1mm
- Operating Temperature :
- 0°C~100°C TJ
- Supply Voltage :
- 0.9V
- JESD-30 Code :
- S-PBGA-B1517
- Number of Logic Elements/Cells :
- 1150000
- HTS Code :
- 8542.39.00.01
- Power Supplies :
- 0.9V
- Height Seated (Max) :
- 3.5mm
- Mounting Type :
- Surface Mount
- Factory Lead Time :
- 8 Weeks
- Number of I/O :
- 600
- Number of Outputs :
- 600
- Total RAM Bits :
- 68857856
- Series :
- Arria 10 GX
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Number of LABs/CLBs :
- 427200
- RoHS Status :
- RoHS Compliant
- Packaging :
- Tray
- Terminal Form :
- Ball
- Qualification Status :
- Not Qualified
- Package / Case :
- 1517-BBGA, FCBGA
- Voltage - Supply :
- 0.87V~0.93V
- Length :
- 40mm
- Number of Inputs :
- 600
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Datasheets
- 10AX115N3F40E2LG
FPGAs Altera (Intel) 10AX115N3F40E2LG Overview
Introducing the high-performance FPGAs Altera (Intel) 10AX115N3F40E2LG, a premier IC FPGA designed for optimal flexibility and efficiency in complex electronic environments. Manufactured by Intel's Altera division, this field-programmable gate array (FPGA) stands out with its robust 1517FCBGA packaging and extensive I/O capabilities with 600 pins. Engineered to tackle the most demanding applications, from data processing to industrial control systems, this FPGA provides developers with the tools to innovate and optimize their systems with considerable scalability and speed.
10AX115N3F40E2LG Features
The 10AX115N3F40E2LG FPGA from Intel’s Altera portfolio offers a comprehensive set of features that make it a versatile choice for a wide range of applications. This device is equipped with a high I/O count, embedded transceivers, and advanced security technology, ensuring robust performance in high-speed communication environments. Its integration in a 1517-pin flip-chip BGA package allows for efficient thermal management and superior signal integrity, crucial for reliable long-term operation.
10AX115N3F40E2LG Applications
- Telecommunications: Utilized in networking equipment such as routers and switches, enhancing data transmission capabilities and supporting high-speed network infrastructures.
- Automotive: Employed in advanced driver-assistance systems (ADAS) to process real-time sensor data, providing critical functionalities like object detection and collision avoidance.
- Data Centers: Integral in server infrastructure, optimizing data processing and storage operations, and supporting the demand for increased data bandwidth and computational power.
- Industrial Automation: Applied in control systems, improving process efficiency and reliability in manufacturing environments through enhanced programmability and operational control.
- Consumer Electronics: Used in high-definition multimedia interfaces and virtual reality systems, offering immense processing power to handle complex algorithms and high-resolution graphics.
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