10AX090N3F40I2SG
- Mfr.Part #
- 10AX090N3F40I2SG
- Manufacturer
- Altera (Intel)
- Package / Case
- 1517-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 600 I/O 1517FCBGA
- Stock
- 48,253
- In Stock :
- 48,253
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- Manufacturer :
- Altera (Intel)
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Terminal Form :
- Ball
- JESD-30 Code :
- S-PBGA-B1517
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- RoHS Status :
- RoHS Compliant
- Number of LABs/CLBs :
- 339620
- Series :
- Arria 10 GX
- Number of I/O :
- 600
- Terminal Pitch :
- 1mm
- Number of Inputs :
- 600
- Mounting Type :
- Surface Mount
- Height Seated (Max) :
- 3.5mm
- Total RAM Bits :
- 59234304
- Factory Lead Time :
- 8 Weeks
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Terminal Position :
- BOTTOM
- Supply Voltage :
- 0.9V
- Width :
- 40mm
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Length :
- 40mm
- Power Supplies :
- 0.9V
- Surface Mount :
- yes
- Qualification Status :
- Not Qualified
- Operating Temperature :
- -40°C~100°C TJ
- Packaging :
- Tray
- Voltage - Supply :
- 0.87V~0.93V
- Package / Case :
- 1517-BBGA, FCBGA
- Number of Outputs :
- 600
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- HTS Code :
- 8542.39.00.01
- Number of Logic Elements/Cells :
- 900000
- Datasheets
- 10AX090N3F40I2SG

FPGAs Altera (Intel) 10AX090N3F40I2SG Overview
Introducing the FPGAs Altera (Intel) 10AX090N3F40I2SG, a cutting-edge IC FPGA designed to meet the complex and demanding needs of modern digital circuits. Engineered by Intel, formerly known as Altera, this component showcases exceptional versatility and performance in a compact 1517FCBGA package. Ideal for applications requiring high-speed data processing and significant I/O capabilities, the 10AX090N3F40I2SG provides a robust platform for innovation across various sectors. Its capacity to handle up to 600 I/O points makes it exceptionally suitable for large-scale integrations in data-sensitive operations.
10AX090N3F40I2SG Features
This FPGA features a high-density integration capacity which is vital for supporting complex, multi-functional devices in technology-driven industries. With its 1517 flip-chip ball grid array (FCBGA) package, it offers excellent thermal and electrical performance, ensuring reliability and efficiency in high-demand applications. The device's programmability allows for rapid prototyping and adjustments in development phases, reducing time-to-market and providing flexibility in design modifications.
10AX090N3F40I2SG Applications
- Telecommunications: Utilized in routing and switching technology to manage data flow and signal processing efficiently.
- Data Centers: Employs its high I/O capacity for managing vast amounts of data, enhancing data storage and retrieval systems.
- Automotive Technology: Integral in developing advanced driver-assistance systems (ADAS), ensuring real-time processing and reliability.
- Industrial Automation: Used in control systems for manufacturing lines, improving precision and productivity through sophisticated programming capabilities.
- Medical Devices: Supports the development of complex medical imaging and diagnostic equipment by facilitating rapid data processing and enhanced imaging capabilities.
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