10AX066K3F35I3SGES

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Mfr.Part #
10AX066K3F35I3SGES
Manufacturer
Altera (Intel)
Package / Case
1152-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 396 I/O 1152FCBGA
Stock
32,840
In Stock :
32,840

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Mounting Type :
Surface Mount
Series :
Arria 10 GX
Total RAM Bits :
49610752
Operating Temperature :
-40°C~100°C TJ
Number of LABs/CLBs :
250540
Voltage - Supply :
0.87V~0.93V
Number of Logic Elements/Cells :
660000
Number of I/O :
396
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Packaging :
Tray
Package / Case :
1152-BBGA, FCBGA
Supplier Device Package :
1152-FCBGA (35x35)
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 10AX066K3F35I3SGES from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:-40°C~100°C TJ, Package / Case:1152-BBGA, FCBGA, 10AX066K3F35I3SGES pinout, 10AX066K3F35I3SGES datasheet PDF, 10AX066K3F35I3SGES amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 10AX066K3F35I3SGES ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 10AX066K3F35I3SGES


FPGAs Altera (Intel) 10AX066K3F35I3SGES Overview

The FPGAs Altera (Intel) 10AX066K3F35I3SGES is a high-performance, field-programmable gate array designed for advanced applications that require substantial logic integration with high-speed I/O capabilities. Manufactured by Altera, now part of Intel, this FPGA offers a robust platform for developing sophisticated hardware in a compact 1152FCBGA package. The ability to reprogram these devices for specific needs while in-field provides unparalleled flexibility, making it an ideal choice for dynamic and evolving technological markets. This versatile chip is engineered to support the demands of high-throughput systems, ensuring both scalability and efficiency in design.

10AX066K3F35I3SGES Features

The 10AX066K3F35I3SGES FPGA stands out with its 396 programmable I/O ports, allowing extensive flexibility in interfacing with other hardware. The chip is housed in a 1152-pin FCBGA (Fine-Pitch Ball Grid Array) package, ensuring robust performance while minimizing physical space requirements on the PCB. Key features include high integration capability, lower power consumption compared to previous generations, and support for multi-gigabit transceivers, enhancing its utility in high-speed communication tasks.

10AX066K3F35I3SGES Applications

  • Data Centers: Utilized for managing data flow and processing tasks, enhancing efficiency and speed in server farms.
  • Telecommunications: Employs its high-speed transceivers in the development of telecommunications infrastructure, significantly boosting data transmission capabilities.
  • Automotive: Integral in advanced driver-assistance systems (ADAS), improving safety and performance through rapid data processing.
  • Video Processing: Applied in high-resolution video processing equipment for real-time image analysis and enhancement.
  • Industrial: Used in control systems for real-time operations management, increasing reliability and precision in industrial settings.
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