10AX057N1F40I1SG

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Mfr.Part #
10AX057N1F40I1SG
Manufacturer
Altera (Intel)
Package / Case
1517-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 588 I/O 1517FCBGA
Stock
1,237
In Stock :
1,237

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Voltage - Supply :
0.87V~0.98V
Series :
Arria 10 GX
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Number of LABs/CLBs :
217080
Number of Logic Elements/Cells :
570000
Number of I/O :
588
Supplier Device Package :
1517-FCBGA (40x40)
Mounting Type :
Surface Mount
Packaging :
Tray
Operating Temperature :
-40°C~100°C TJ
RoHS Status :
RoHS Compliant
Package / Case :
1517-BBGA, FCBGA
Total RAM Bits :
42082304
Datasheets
10AX057N1F40I1SG
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 10AX057N1F40I1SG from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:-40°C~100°C TJ, Package / Case:1517-BBGA, FCBGA, 10AX057N1F40I1SG pinout, 10AX057N1F40I1SG datasheet PDF, 10AX057N1F40I1SG amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 10AX057N1F40I1SG ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 10AX057N1F40I1SG


FPGAs Altera (Intel) 10AX057N1F40I1SG Overview

The FPGAs Altera (Intel) 10AX057N1F40I1SG integrates state-of-the-art technology from Intel’s renowned FPGA product lineup, providing a high-performance, flexible, and efficient solution for a vast array of complex electronic systems. This IC FPGA, housed in a 1517FCBGA package, features 588 input/output options that facilitate robust, versatile interfacing capabilities. Ideal for demanding applications, this component is designed to support rapid prototyping and development across various sectors, ensuring high-speed operation and reliability.

10AX057N1F40I1SG Features

This FPGA excels in delivering high-speed digital processing capabilities with its abundant I/O pins, providing essential connectivity for high-density applications. The 1517 ball grid array (BGA) packaging ensures a compact footprint while allowing for efficient heat dissipation and reduced latency in signal processing. The chip is also characterized by its adaptability to multiple programming environments, enhancing utility for system designers and developers.

10AX057N1F40I1SG Applications

  • Telecommunications Equipment: Used in routers and switches, this FPGA enhances processing speeds and connectivity, improving network efficiency and reliability.
  • Automotive Systems: Integral in advanced driver-assistance systems (ADAS), it processes inputs from vehicle sensors more quickly, enhancing safety features.
  • Data Centers: Key in managing data processing tasks, it increases the speed and efficiency of data handling and cloud computing services.
  • Medical Devices: Critical for real-time processing in medical imaging equipment, aiding in faster and more accurate diagnostics.
  • Consumer Electronics: Empowers high-performance computing tasks within consumer electronics, such as gaming consoles and smart TVs, providing enhanced user experiences.
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