10AX048K4F35E3SG
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- Mfr.Part #
- 10AX048K4F35E3SG
- Manufacturer
- Altera (Intel)
- Package / Case
- 1152-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC FPGA 396 I/O 1152FBGA
- Stock
- 23,094
- In Stock ：
- 23,094
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- Manufacturer :
- Altera (Intel)
- Product Category :
- FPGAs (Field Programmable Gate Array)
- Terminal Form :
- Ball
- Supply Voltage :
- 0.9V
- Packaging :
- Tray
- Number of I/O :
- 396
- Terminal Position :
- BOTTOM
- Programmable Logic Type :
- FIELD PROGRAMMABLE GATE ARRAY
- HTS Code :
- 8542.39.00.01
- Mounting Type :
- Surface Mount
- Factory Lead Time :
- 11 Weeks
- Number of Inputs :
- 396
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Voltage - Supply :
- 0.87V~0.98V
- Power Supplies :
- 0.9V
- Qualification Status :
- Not Qualified
- Terminal Pitch :
- 1mm
- Package / Case :
- 1152-BBGA, FCBGA
- Series :
- Arria 10 GX
- Number of Outputs :
- 396
- JESD-30 Code :
- S-PBGA-B1152
- Total RAM Bits :
- 5664768
- RoHS Status :
- RoHS Compliant
- Width :
- 35mm
- Length :
- 35mm
- Height Seated (Max) :
- 3.5mm
- Number of LABs/CLBs :
- 183590
- Operating Temperature :
- 0°C~100°C TJ
- Surface Mount :
- yes
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Number of Logic Elements/Cells :
- 480000
- Datasheets
- 10AX048K4F35E3SG
FPGAs Altera 10AX048K4F35E3SG Overview
The FPGAs Altera 10AX048K4F35E3SG, manufactured by Intel's Altera division, represents a cutting-edge solution in the realm of programmable logic devices. This particular model is designed to cater to the demanding requirements of high-speed and high-density applications across various industries. The FPGA features a robust 1152-pin FineLine BGA package, which facilitates a compact form factor while supporting a vast array of I/O options, numbering up to 396. With its advanced architecture and versatile programmability, the 10AX048K4F35E3SG FPGA is ideal for designers looking to integrate complex logic functions into their systems while maintaining flexibility and scalability in design.
10AX048K4F35E3SG Features
- 1152-pin FineLine BGA (FBGA) package for high-density mounting.
- 396 I/O pins providing extensive connectivity for complex applications.
- Integrated with Intel's advanced FPGA technology, ensuring superior performance and reliability.
- High configurability and programmability to meet diverse application requirements.
- Support for multiple design standards and protocols, enhancing device utility across different platforms.
10AX048K4F35E3SG Applications
- Telecommunications Infrastructure: Utilized in routers, switches, and base stations to manage data flow and signal processing efficiently.
- Automotive Electronics: Integrated into driver assistance systems to process real-time sensor data and enhance vehicle safety and functionality.
- Industrial Automation: Employed in control systems for automation and process management, improving operational reliability and efficiency.
- Data Centers: Essential in managing data storage and processing operations, ensuring high-speed data handling and system scalability.
- Consumer Electronics: Used in high-performance gaming consoles and home entertainment systems to provide enhanced graphics and user experience.
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