10AX032E3F29E2LG

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Mfr.Part #
10AX032E3F29E2LG
Manufacturer
Altera (Intel)
Package / Case
780-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 360 I/O 780FBGA
Stock
7,439
In Stock :
7,439

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Terminal Form :
Ball
Package / Case :
780-BBGA, FCBGA
Voltage - Supply :
0.87V~0.93V
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Surface Mount :
yes
Terminal Pitch :
1mm
Power Supplies :
0.9V
Number of Inputs :
360
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Packaging :
Tray
Operating Temperature :
0°C~100°C TJ
Number of Terminations :
780
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Number of LABs/CLBs :
119900
Supply Voltage :
0.9V
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Factory Lead Time :
8 Weeks
Series :
Arria 10 GX
Mounting Type :
Surface Mount
Number of I/O :
360
Terminal Position :
BOTTOM
Length :
29mm
Total RAM Bits :
21040128
Number of Logic Elements/Cells :
320000
Number of Outputs :
360
HTS Code :
8542.39.00.01
Height Seated (Max) :
3.35mm
RoHS Status :
RoHS Compliant
Qualification Status :
Not Qualified
Width :
29mm
JESD-30 Code :
S-PBGA-B780
Datasheets
10AX032E3F29E2LG
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 10AX032E3F29E2LG from Chip IC,where excellence meets affordability. This product stands out with its Package / Case:780-BBGA, FCBGA, Operating Temperature:0°C~100°C TJ, Number of Terminations:780, Mounting Type:Surface Mount, 10AX032E3F29E2LG pinout, 10AX032E3F29E2LG datasheet PDF, 10AX032E3F29E2LG amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 10AX032E3F29E2LG ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 10AX032E3F29E2LG


FPGAs Altera (Intel) 10AX032E3F29E2LG Overview

The FPGAs Altera (Intel) 10AX032E3F29E2LG is a high-performance, feature-rich Field Programmable Gate Array (FPGA) that meets the complex demands of modern digital circuits. Designed by Altera, now part of Intel, this device encapsulates cutting-edge technology suitable for a plethora of applications requiring high-speed data processing and flexible hardware configuration. With a configuration of 360 I/O pins packed into a compact 780FBGA package, this FPGA is ideally suited for advanced system designs where space and power efficiency are critical. The integration capabilities and versatility of the 10AX032E3F29E2LG make it an essential component for developers looking to push the boundaries of technology in various industrial settings.

10AX032E3F29E2LG Features

This FPGA boasts a robust set of features including a dense array of logic elements, high-speed transceiver lanes, and comprehensive memory integration. The high I/O pin count supports extensive peripheral connectivity, making it adaptable for complex digital integrations. Advanced security features ensure device and data integrity, crucial for systems requiring reliable and secure operations. Additionally, its compatibility with Intel's sophisticated design software enhances the ease of use in system development and scalability.

10AX032E3F29E2LG Applications

  • Telecommunications Equipment: Utilizes high-speed transceivers for data transfer and processing tasks in routers and switches.
  • Data Centers: Supports high-performance computing tasks with its ability to manage multiple data streams and interfaces efficiently.
  • Automotive Technology: Ideal for driver assistance systems where rapid data processing and response times are necessary.
  • Industrial Automation: Plays a critical role in control systems requiring real-time processing and high reliability.
  • Consumer Electronics: Used in devices requiring complex user interfaces and connectivity features, such as smart TVs and advanced wearable technology.
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