10AX032E2F29E1SG

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Mfr.Part #
10AX032E2F29E1SG
Manufacturer
Altera (Intel)
Package / Case
780-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 360 I/O 780FBGA
Stock
25,267
In Stock :
25,267

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Packaging :
Tray
Operating Temperature :
0°C~100°C TJ
Terminal Pitch :
1mm
Surface Mount :
yes
Power Supplies :
0.9V
Number of Logic Elements/Cells :
320000
Number of Outputs :
360
RoHS Status :
RoHS Compliant
Number of Inputs :
360
Terminal Form :
Ball
HTS Code :
8542.39.00.01
Number of LABs/CLBs :
119900
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Height Seated (Max) :
3.35mm
Terminal Position :
BOTTOM
Number of Terminations :
780
Series :
Arria 10 GX
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Width :
29mm
Supply Voltage :
0.9V
Number of I/O :
360
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Length :
29mm
Total RAM Bits :
21040128
Package / Case :
780-BBGA, FCBGA
JESD-30 Code :
S-PBGA-B780
Voltage - Supply :
0.87V~0.98V
Qualification Status :
Not Qualified
Mounting Type :
Surface Mount
Datasheets
10AX032E2F29E1SG
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 10AX032E2F29E1SG from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~100°C TJ, Number of Terminations:780, Package / Case:780-BBGA, FCBGA, Mounting Type:Surface Mount, 10AX032E2F29E1SG pinout, 10AX032E2F29E1SG datasheet PDF, 10AX032E2F29E1SG amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 10AX032E2F29E1SG ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 10AX032E2F29E1SG


FPGAs (Field Programmable Gate Array) Altera (Intel) 10AX032E2F29E1SG Overview

The FPGAs (Field Programmable Gate Array) Altera (Intel) 10AX032E2F29E1SG is a highly versatile and powerful integrated circuit designed by Altera, now part of Intel. This FPGA is engineered to meet the demanding needs of modern digital applications, offering a robust suite of features including a high I/O count and a compact 780 FBGA package. Its flexibility and performance capabilities make it an ideal choice for developers looking to push the boundaries of technology in various high-tech industries. This product not only exemplifies cutting-edge technology but also demonstrates Intel's commitment to delivering scalable and efficient solutions.

10AX032E2F29E1SG Features

This particular model of FPGA offers 360 I/O pins, which provides ample flexibility for interfacing with other hardware components. The 780-pin FBGA (Fine-Pitch Ball Grid Array) packaging ensures a compact form factor that is beneficial for space-constrained applications while maintaining robust performance and reliability. The integration capabilities and programmability of this FPGA make it highly suitable for complex digital computations and signal processing tasks.

10AX032E2F29E1SG Applications

  • Telecommunications: Utilized in communication infrastructure equipment to facilitate rapid data processing and signal integrity.
  • Automotive Technology: Employs advanced driver-assistance systems (ADAS) to enhance vehicle safety through high-speed real-time processing.
  • Industrial Automation: Integral in controlling machinery and processes that require high levels of precision and adaptability.
  • Consumer Electronics: Applied in high-performance gaming consoles and home entertainment systems for improved graphics and processing power.
  • Medical Devices: Helps in the development of medical imaging systems such as MRI and ultrasound equipment, offering precise and fast processing capabilities essential for high-resolution images.
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