10AX027H4F35I3SG

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Mfr.Part #
10AX027H4F35I3SG
Manufacturer
Altera (Intel)
Package / Case
1152-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 384 I/O 1152FBGA
Stock
41,192
In Stock :
41,192

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Terminal Position :
BOTTOM
RoHS Status :
RoHS Compliant
Qualification Status :
Not Qualified
Total RAM Bits :
17870848
Number of Outputs :
384
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Mounting Type :
Surface Mount
JESD-30 Code :
S-PBGA-B1152
Surface Mount :
yes
Terminal Pitch :
1mm
Width :
35mm
Power Supplies :
0.9V
Operating Temperature :
-40°C~100°C TJ
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Number of Inputs :
384
Series :
Arria 10 GX
HTS Code :
8542.39.00.01
Number of Logic Elements/Cells :
270000
Length :
35mm
Terminal Form :
Ball
Height Seated (Max) :
3.5mm
Supply Voltage :
0.9V
Factory Lead Time :
8 Weeks
Number of LABs/CLBs :
101620
Number of I/O :
384
Voltage - Supply :
0.87V~0.98V
Packaging :
Tray
Package / Case :
1152-BBGA, FCBGA
Datasheets
10AX027H4F35I3SG
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 10AX027H4F35I3SG from Chip IC,where excellence meets affordability. This product stands out with its Mounting Type:Surface Mount, Operating Temperature:-40°C~100°C TJ, Package / Case:1152-BBGA, FCBGA, 10AX027H4F35I3SG pinout, 10AX027H4F35I3SG datasheet PDF, 10AX027H4F35I3SG amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 10AX027H4F35I3SG ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 10AX027H4F35I3SG


FPGAs Altera (Intel) 10AX027H4F35I3SG Overview

Introducing the FPGAs Altera (Intel) 10AX027H4F35I3SG, a high-performance integrated circuit developed by Altera (now part of Intel). This IC FPGA stands out in the field for its impressive flexibility and capability to meet rigorous computational demands. Equipped with 384 I/O pins housed in a compact 1152FBGA package, this device is engineered to facilitate sophisticated and scalable hardware acceleration. Its design and structure are suited for applications that require high-speed data processing and versatile configuration possibilities, making it an ideal choice for advanced digital systems development.

10AX027H4F35I3SG Features

The 10AX027H4F35I3SG FPGA offers a plethora of features designed for optimal efficiency and adaptability in various high-tech applications. It supports integrated DSP blocks, enabling advanced digital signal processing. High-density logic gates allow for extensive customization and functionality within a single chip. The device's low power consumption coupled with its high-speed transceiver lines provides a robust solution for designing energy-efficient and powerful systems.

10AX027H4F35I3SG Applications

  • Data Centers: Utilized in server infrastructure to optimize data flow and process management, enhancing overall efficiency and reducing latency.
  • Telecommunications: Employs its high-speed transceivers in communication equipment to boost signal processing capabilities and support high-bandwidth operations.
  • Automotive: Integrated into driver assistance systems to process real-time data from sensors, improving vehicle safety and functionality.
  • Industrial Automation: Applied in control systems to manage complex operations, increasing precision and reliability in manufacturing processes.
  • Consumer Electronics: Used in high-definition video processing equipment to enhance visual output and support advanced user interfaces.
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