10AX027H3F35E2SG

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Mfr.Part #
10AX027H3F35E2SG
Manufacturer
Altera (Intel)
Package / Case
1152-BBGA, FCBGA
Datasheet
Download
Description
IC FPGA 384 I/O 1152FBGA
Stock
3
In Stock :
3

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Manufacturer :
Altera (Intel)
Product Category :
FPGAs (Field Programmable Gate Array)
Series :
Arria 10 GX
Operating Temperature :
0°C~100°C TJ
RoHS Status :
RoHS Compliant
Length :
35mm
Surface Mount :
yes
Package / Case :
1152-BBGA, FCBGA
Moisture Sensitivity Level (MSL) :
3 (168 Hours)
Terminal Position :
BOTTOM
Power Supplies :
0.9V
Width :
35mm
Total RAM Bits :
17870848
Qualification Status :
Not Qualified
Time@Peak Reflow Temperature-Max (s) :
NOT SPECIFIED
Peak Reflow Temperature (Cel) :
NOT SPECIFIED
Supply Voltage :
0.9V
Voltage - Supply :
0.87V~0.93V
Number of Logic Elements/Cells :
270000
Packaging :
Tray
Factory Lead Time :
8 Weeks
JESD-30 Code :
S-PBGA-B1152
Programmable Logic Type :
FIELD PROGRAMMABLE GATE ARRAY
Number of Outputs :
384
Height Seated (Max) :
3.5mm
Terminal Form :
Ball
Terminal Pitch :
1mm
Number of I/O :
384
Number of Inputs :
384
Number of LABs/CLBs :
101620
Mounting Type :
Surface Mount
HTS Code :
8542.39.00.01
Datasheets
10AX027H3F35E2SG
Introducing FPGAs (Field Programmable Gate Array) Altera (Intel) 10AX027H3F35E2SG from Chip IC,where excellence meets affordability. This product stands out with its Operating Temperature:0°C~100°C TJ, Package / Case:1152-BBGA, FCBGA, Mounting Type:Surface Mount, 10AX027H3F35E2SG pinout, 10AX027H3F35E2SG datasheet PDF, 10AX027H3F35E2SG amp .Beyond FPGAs (Field Programmable Gate Array) Altera (Intel) 10AX027H3F35E2SG ,we also offer T35F400C3, T55F324C3, T120F324C3, Our vast inventory has you covered. Contact us now for immediate solutions.

Altera (Intel) 10AX027H3F35E2SG


FPGAs Altera 10AX027H3F35E2SG Overview

The FPGAs Altera 10AX027H3F35E2SG, manufactured by Intel's acquired company Altera, represents a cutting-edge solution in the field of programmable logic. Designed to meet the rigorous demands of high-performance applications, this IC FPGA integrates seamlessly into complex electronic systems. It provides a flexible environment with its extensive I/O capabilities and large-scale integration, housed in a 1152FBGA package. This product is particularly tailored for designers and engineers looking for versatile, high-speed programmable logic solutions that can support a wide range of applications, ensuring both efficiency and scalability.

10AX027H3F35E2SG Features

This FPGA features 384 input/output pins, allowing for ample connectivity and interfacing options. Its 1152FBGA package ensures a compact footprint while enabling robust performance and reliability in high-density applications. The integration capabilities of the 10AX027H3F35E2SG facilitate complex system designs, which require substantial logic and processing power. As part of Intel's commitment to technological advancement, this FPGA is designed with advanced silicon technology that supports superior signal integrity and increased functionality.

10AX027H3F35E2SG Applications

  • Telecommunications Infrastructure: Applied in routers and switches, this FPGA facilitates complex data processing and high-speed signal management, enhancing network efficiency and reliability.
  • Automotive Technology: Used in driver assistance systems, the 10AX027H3F35E2SG handles real-time processing of sensors and data streams, improving vehicle safety and performance.
  • Industrial Automation: In control systems, this FPGA delivers the necessary computation power and connectivity for managing automated production lines, ensuring precision and adaptability.
  • Consumer Electronics: Integrated into devices like high-definition televisions and gaming consoles, it supports advanced graphics and user interface management, enriching the user experience.
  • Medical Devices: Utilized in imaging systems such as MRI and ultrasound equipment, ensuring fast and accurate data processing capabilities that are critical for medical diagnostics.
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