IRF9953
- Mfr.Part #
- IRF9953
- Manufacturer
- Infineon Technologies
- Package / Case
- 8-SOIC (0.154, 3.90mm Width)
- Datasheet
- Download
- Description
- MOSFET 2P-CH 30V 2.3A 8-SOIC
- Stock
- 25,200
- In Stock :
- 25,200
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Arrays
- Number of Terminations :
- 8
- JESD-609 Code :
- e0
- RoHS Status :
- Non-RoHS Compliant
- Packaging :
- Tube
- Peak Reflow Temperature (Cel) :
- 245
- Operating Temperature :
- -55°C~150°C TJ
- Power - Max :
- 2W
- Additional Feature :
- High Reliability
- Surface Mount :
- yes
- Package / Case :
- 8-SOIC (0.154, 3.90mm Width)
- ECCN Code :
- EAR99
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Operating Mode :
- ENHANCEMENT MODE
- Pulsed Drain Current-Max (IDM) :
- 10A
- FET Feature :
- Logic Level Gate
- Input Capacitance (Ciss) (Max) @ Vds :
- 190pF @ 15V
- DS Breakdown Voltage-Min :
- 30V
- Gate Charge (Qg) (Max) @ Vgs :
- 12nC @ 10V
- JESD-30 Code :
- R-PDSO-G8
- Series :
- HEXFET®
- Published :
- 1997
- FET Type :
- 2 P-Channel (Dual)
- Mounting Type :
- Surface Mount
- Number of Elements :
- 2
- Qualification Status :
- Not Qualified
- Configuration :
- SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
- Current - Continuous Drain (Id) @ 25°C :
- 2.3A
- Drain to Source Voltage (Vdss) :
- 30V
- Vgs(th) (Max) @ Id :
- 1V @ 250μA
- Drain-source On Resistance-Max :
- 0.25Ohm
- Transistor Element Material :
- SILICON
- Terminal Form :
- Gull wing
- Drain Current-Max (Abs) (ID) :
- 2.3A
- Terminal Finish :
- TIN LEAD
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Rds On (Max) @ Id, Vgs :
- 250m Ω @ 1A, 10V
- Transistor Application :
- SWITCHING
- Avalanche Energy Rating (Eas) :
- 57 mJ
- FET Technology :
- METAL-OXIDE SEMICONDUCTOR
- Datasheets
- IRF9953

IRF9953 datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available at
IRF9953 Description
The fifth generation HEXFET of the International Rectifier Company adopts advanced technology to achieve a very low on-resistance per silicon, this advantage. Combined with HEXFET Power MOSFET's well-known fast switching speed and rugged device design, it provides designers with an extremely efficient and reliable device for use in a variety of applications.
The SO-8 has been modified with a custom l ead f rame to enhance properties and multi-chip capabilities, making it an ideal choice for a variety of power applications.With these improvements multiple devices that can be used to greatly reduce circuit board space. The package is designed for vapor phase red inner or wave soldering technology.
IRF9953 Features
Planar cell structure for wide SOA
Optimized for broadest availability from distribution partners
Product qualification according to JEDEC standard
Silicon optimized for applications switching below <100KHz
Industry standard surface-mount power package
IRF9953 Applications
making it an ideal choice for a variety of power applications
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