IRF9395MTRPBF
- Mfr.Part #
- IRF9395MTRPBF
- Manufacturer
- Infineon Technologies
- Package / Case
- DirectFET™ Isometric MC
- Datasheet
- Download
- Description
- MOSFET 2P-CH 30V 14A DIRECTFET
- Stock
- 9,443
- In Stock :
- 9,443
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Arrays
- Drain Current-Max (Abs) (ID) :
- 75A
- Input Capacitance (Ciss) (Max) @ Vds :
- 3241pF @ 15V
- Packaging :
- Tape and Reel (TR)
- Rise Time :
- 142ns
- Transistor Application :
- SWITCHING
- JESD-30 Code :
- R-XBCC-N6
- Power Dissipation :
- 2.1W
- Turn-Off Delay Time :
- 76 ns
- ECCN Code :
- EAR99
- Operating Mode :
- ENHANCEMENT MODE
- Factory Lead Time :
- 17 Weeks
- Radiation Hardening :
- No
- Operating Temperature :
- -40°C~150°C TJ
- Package / Case :
- DirectFET™ Isometric MC
- Mount :
- Surface Mount
- Number of Terminations :
- 6
- Series :
- HEXFET®
- FET Type :
- 2 P-Channel (Dual)
- Vgs(th) (Max) @ Id :
- 2.4V @ 50μA
- Mounting Type :
- Surface Mount
- Fall Time (Typ) :
- 121 ns
- Transistor Element Material :
- SILICON
- Max Power Dissipation :
- 2.1W
- Terminal Finish :
- Matte Tin (Sn)
- Published :
- 2007
- RoHS Status :
- ROHS3 Compliant
- Number of Elements :
- 1
- Element Configuration :
- Dual
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Gate to Source Voltage (Vgs) :
- 20V
- Terminal Position :
- BOTTOM
- Gate Charge (Qg) (Max) @ Vgs :
- 64nC @ 10V
- Number of Pins :
- 10
- Drain to Source Voltage (Vdss) :
- 30V
- Rds On (Max) @ Id, Vgs :
- 7m Ω @ 14A, 10V
- FET Feature :
- Logic Level Gate
- JESD-609 Code :
- e3
- Continuous Drain Current (ID) :
- 14A
- Drain-source On Resistance-Max :
- 0.007Ohm
- Drain to Source Breakdown Voltage :
- -30V
- Case Connection :
- DRAIN
- FET Technology :
- METAL-OXIDE SEMICONDUCTOR
- Turn On Delay Time :
- 19 ns
- Datasheets
- IRF9395MTRPBF

IRF9395MTRPBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available at
IRF9395MTRPBF Description
IRF9395MTRPbF combines the latest HEXFET P-channel power MOSFET silicon technology with advanced DirectFETTM packaging to achieve the lowest on-resistance in a 0.6 mm package. The DirectFET package is compatible with existing layout geometry used in power applications, printed circuit board assembly equipment and gas phase, infrared or convection soldering technologies, as long as the manufacturing method and process instructions in the AN-1035 application instructions are followed. The DirectFET package allows double-sided cooling to maximize heat transfer in the power system, increasing the previously optimal thermal resistance by 80 per cent.
IRF9395MTRPBF Applications
·Isolation Switch for Input Power or Battery Application
IRF9395MTRPBF Features
Environmentaly Friendly Product
RoHs Compliant Containing no Lead no Bromide and no Halogen
Dual Common-Drain P-Channel MOSFETs Provides High Level of Integration and Very Low RDS(on)
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