X66AK2H12AXAAW2
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- Mfr.Part #
- X66AK2H12AXAAW2
- Manufacturer
- Texas Instruments
- Package / Case
- 1517-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC DSP ARM SOC BGA
- Stock
- 47,611
- In Stock ：
- 47,611
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- Manufacturer :
- Texas Instruments
- Product Category :
- DSP (Digital Signal Processors)
- JESD-609 Code :
- e1
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Mounting Type :
- Surface Mount
- Frequency :
- 1.2GHz
- Type :
- DSP+ARM®
- Non-Volatile Memory :
- ROM (384kB)
- Terminal Pitch :
- 1mm
- Min Supply Voltage :
- 902mV
- Base Part Number :
- 66AK2H12
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Voltage - Core :
- Variable
- Operating Temperature :
- 0°C~85°C TC
- Mount :
- Surface Mount
- Supply Voltage :
- 1V
- RAM Size :
- 512kB
- Integrated Cache :
- yes
- Number of Timers/Counters :
- 20
- Terminal Finish :
- Tin/Silver/Copper (Sn/Ag/Cu)
- Memory Type :
- SRAM
- Peak Reflow Temperature (Cel) :
- 245
- Series :
- 66AK2Hx KeyStone Multicore
- Lead Free :
- Lead Free
- Core Architecture :
- ARM
- Height Seated (Max) :
- 3.75mm
- Width :
- 40mm
- Package / Case :
- 1517-BBGA, FCBGA
- Low Power Mode :
- yes
- Interface :
- EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0
- Boundary Scan :
- yes
- Terminal Position :
- BOTTOM
- On Chip Data RAM :
- 12.75MB
- Packaging :
- Tray
- Format :
- Floating Point
- Voltage - I/O :
- 0.85V 1.0V 1.35V 1.5V 1.8V 3.3V
- Pbfree Code :
- yes
- RoHS Status :
- Non-RoHS Compliant
- External Data Bus Width :
- 16
- Address Bus Width :
- 24
- Terminal Form :
- Ball
- Number of Pins :
- 1517
- Length :
- 40mm
- Datasheets
- X66AK2H12AXAAW2
DSP Texas Instruments X66AK2H12AXAAW2 Overview
The DSP Texas Instruments X66AK2H12AXAAW2 is an advanced Digital Signal Processor (DSP) that integrates powerful ARM architecture, making it highly suitable for demanding signal processing applications. This IC is engineered to deliver high performance and efficiency, enabling sophisticated signal management and data processing capabilities. The compact BGA package ensures a minimal footprint on system boards, which is critical for modern, space-constrained electronic devices. With its robust processing power and integration features, the DSP Texas Instruments X66AK2H12AXAAW2 is ideal for developers looking to enhance system performance while maintaining low power consumption.
X66AK2H12AXAAW2 Features
The X66AK2H12AXAAW2 from Texas Instruments boasts several key features that make it a leading choice for integration into advanced electronic systems. These include its high-speed ARM processor core, extensive on-chip memory, and versatile I/O options. The device's ability to handle complex algorithms efficiently makes it an excellent choice for real-time processing tasks. Additionally, its low-power operation and compact BGA packaging facilitate easier thermal management and integration into tight spaces.
X66AK2H12AXAAW2 Applications
- Automotive Advanced Driver Assistance Systems (ADAS): Utilizes signal processing capabilities to interpret sensor data, aiding in real-time decision making for safety features.
- Medical Imaging Systems: Processes complex imaging algorithms, improving the clarity and speed of scans in medical diagnostics.
- Telecommunications Infrastructure: Employs DSP capabilities for efficient signal modulation and demodulation in network equipment, enhancing data throughput and reliability.
- Audio Processing Equipment: Delivers detailed audio signal processing, which is essential for high-fidelity sound systems in professional audio setups.
- Industrial Automation: Implements control algorithms swiftly, improving the response times and efficiency of automated industrial systems.
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