X66AK2H12AAWA2
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- Mfr.Part #
- X66AK2H12AAWA2
- Manufacturer
- Texas Instruments
- Package / Case
- 1517-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC DSP ARM SOC BGA
- Stock
- 20,725
- In Stock ：
- 20,725
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- Manufacturer :
- Texas Instruments
- Product Category :
- DSP (Digital Signal Processors)
- Interface :
- EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0
- Height :
- 800μm
- Operating Temperature :
- -40°C~100°C TC
- Integrated Cache :
- yes
- Type :
- DSP+ARM®
- Pbfree Code :
- No
- Mount :
- Surface Mount
- Memory Size :
- 4MB
- Series :
- 66AK2Hx KeyStone Multicore
- Boundary Scan :
- yes
- Packaging :
- Tray
- HTS Code :
- 8542.31.00.01
- RAM Size :
- 32kB
- On Chip Data RAM :
- 12.75MB
- Non-Volatile Memory :
- ROM (384kB)
- ECCN Code :
- 3A001.A.3
- Terminal Position :
- BOTTOM
- Min Supply Voltage :
- 800mV
- Max Supply Voltage :
- 1.1V
- Terminal Form :
- Ball
- Mounting Type :
- Surface Mount
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- RoHS Status :
- Non-RoHS Compliant
- Lead Free :
- Contains Lead
- Supply Voltage :
- 1V
- Length :
- 38mm
- Core Architecture :
- ARM
- Low Power Mode :
- yes
- Base Part Number :
- 66AK2H12
- Format :
- Floating Point
- Voltage - I/O :
- 0.85V 1.0V 1.35V 1.5V 1.8V 3.3V
- Number of I/O :
- 32
- Terminal Pitch :
- 1mm
- Voltage - Core :
- Variable
- JESD-30 Code :
- S-PBGA-B1517
- Package / Case :
- 1517-BBGA, FCBGA
- Width :
- 38mm
- Number of Timers/Counters :
- 20
- Frequency :
- 1.2GHz
- Datasheets
- X66AK2H12AAWA2
DSP Texas Instruments X66AK2H12AAWA2 Overview
The Texas Instruments X66AK2H12AAWA2 is a high-performance digital signal processor (DSP) that integrates advanced ARM SOC capabilities in a compact BGA package. Designed for demanding applications that require robust data processing, this DSP from Texas Instruments offers exceptional computational power and efficiency. Ideal for industries seeking to streamline operations through advanced signal processing technology, the X66AK2H12AAWA2 is engineered to handle complex algorithms and multitasking environments effectively. Its integration features make it a preferred choice for developers looking to innovate with high-speed signal computations and precise control applications.
X66AK2H12AAWA2 Features
This DSP device incorporates a range of features designed to enhance performance and ease of integration. Key features include a powerful ARM core, flexible SOC architecture, and a BGA package that ensures reduced space usage on circuit boards. These attributes make the DSP highly suitable for embedded systems where efficiency and space economy are critical.
X66AK2H12AAWA2 Applications
- Automotive Systems: Used in advanced driver-assistance systems (ADAS) to process real-time data from vehicle sensors, enhancing safety and performance.
- Telecommunications: Essential in the processing of signal data for telecommunications equipment, facilitating faster data transmission and improved reliability.
- Audio Processing: Implements algorithms for sound quality enhancement in audio systems, ensuring clear and rich audio reproduction.
- Medical Imaging: Applied in medical imaging systems like ultrasound and MRI for real-time image processing, significantly improving diagnostic capabilities.
- Industrial Automation: Helps in managing and controlling automated machinery in industrial settings, increasing precision and productivity.
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