X66AK2H12AAW24
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- Mfr.Part #
- X66AK2H12AAW24
- Manufacturer
- Texas Instruments
- Package / Case
- 1517-BBGA, FCBGA
- Datasheet
- Download
- Description
- IC DSP ARM SOC BGA
- Stock
- 48,465
- In Stock ：
- 48,465
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- Manufacturer :
- Texas Instruments
- Product Category :
- DSP (Digital Signal Processors)
- Format :
- Floating Point
- Package / Case :
- 1517-BBGA, FCBGA
- Clock Rate :
- 1.2GHz DSP, 1.4GHz ARM®
- Operating Temperature :
- 0°C~85°C TC
- Min Supply Voltage :
- 800mV
- RAM Size :
- 32kB
- Packaging :
- Tray
- Supply Voltage :
- 1V
- Number of I/O :
- 32
- Terminal Form :
- Ball
- Max Supply Voltage :
- 1.1V
- Moisture Sensitivity Level (MSL) :
- 3 (168 Hours)
- Base Part Number :
- 66AK2H12
- Interface :
- EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0
- Height :
- 800μm
- RoHS Status :
- Non-RoHS Compliant
- Memory Size :
- 4MB
- Frequency :
- 1.4GHz
- Width :
- 38mm
- Non-Volatile Memory :
- ROM (384kB)
- Voltage - Core :
- Variable
- Number of Timers/Counters :
- 20
- Mount :
- Surface Mount
- Speed :
- 1400 MHz
- ECCN Code :
- 3A001.A.3
- Voltage - I/O :
- 0.85V 1.0V 1.35V 1.5V 1.8V 3.3V
- HTS Code :
- 8542.31.00.01
- Lead Free :
- Contains Lead
- Type :
- DSP+ARM®
- Mounting Type :
- Surface Mount
- Low Power Mode :
- yes
- Integrated Cache :
- yes
- Length :
- 38mm
- Core Architecture :
- ARM
- JESD-30 Code :
- S-PBGA-B1517
- On Chip Data RAM :
- 12.75MB
- Terminal Pitch :
- 1mm
- Terminal Position :
- BOTTOM
- Pbfree Code :
- No
- Series :
- 66AK2Hx KeyStone Multicore
- Boundary Scan :
- yes
- Datasheets
- X66AK2H12AAW24
DSP Texas Instruments X66AK2H12AAW24 Overview
The DSP Texas Instruments X66AK2H12AAW24 is a highly integrated and efficient ARM SOC BGA that serves as a cornerstone for advanced digital processing applications. This product from Texas Instruments combines the power of DSP with the versatility of an ARM processor, encapsulated in a robust BGA package for superior performance and reliability. Designed to tackle complex signal processing tasks with ease, the X66AK2H12AAW24 excels in environments requiring high-speed data processing and real-time analytics. Its integration facilitates reduced system complexity and enhances overall system reliability, making it a preferred choice for developers and engineers looking to innovate and optimize their digital systems.
X66AK2H12AAW24 Features
The X66AK2H12AAW24 is packed with features designed for robust digital signal processing, including advanced multi-core processing capabilities which allow for high-performance multitasking and improved system efficiency. The integration of ARM architecture provides a flexible and powerful environment for running complex algorithms and supporting high-level operating systems. Additionally, its BGA packaging ensures reliable connectivity and enhanced thermal management, critical for maintaining performance in demanding applications.
X66AK2H12AAW24 Applications
- Telecommunications: Utilized in equipment for data signal processing, the X66AK2H12AAW24 helps in managing high-speed data transfers and real-time communication protocols.
- Audio Processing: Ideal for advanced audio systems, it processes complex audio algorithms to deliver high fidelity and clear sound in systems like high-end audio receivers and digital mixing consoles.
- Industrial Control Systems: Supports robust control systems by managing real-time data processing tasks, ensuring precise control in automation and robotics.
- Medical Imaging: Used in medical diagnostic equipment, the DSP capabilities of the X66AK2H12AAW24 enable rapid and accurate image processing, crucial for modern medical imaging techniques such as MRI and ultrasound.
- Automotive: Enhances automotive safety and functionality through its integration in systems requiring high-level signal processing for features like advanced driver-assistance systems (ADAS).
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