PSMN028-100YS115

Manufacturer :

NXP Semiconductors

Product Category :

Specialized ICs

Package / Case :

SC-100, SOT-669

Number of Terminations :

4

Radiation Hardening :

No

Packaging :

Tape and Reel (TR)

Published :

2010

Input Capacitance (Ciss) (Max) @ Vds :

1634pF @ 50V

Continuous Drain Current (ID) :

42A

Operating Temperature :

-55°C~175°C TJ

Transistor Element Material :

SILICON

Turn On Delay Time :

15 ns

Pin Count :

4

Turn-Off Delay Time :

33 ns

Moisture Sensitivity Level (MSL) :

1 (Unlimited)

Mounting Type :

Surface Mount

Operating Mode :

ENHANCEMENT MODE

Gate to Source Voltage (Vgs) :

20V

Current - Continuous Drain (Id) @ 25°C :

42A Tc

Drain-source On Resistance-Max :

0.0275Ohm

FET Type :

N-Channel

Surface Mount :

No

Case Connection :

DRAIN

Terminal Form :

THROUGH-HOLE

Terminal Position :

Single

Avalanche Energy Rating (Eas) :

68 mJ

Vgs (Max) :

±20V

Fall Time (Typ) :

12 ns

Drive Voltage (Max Rds On,Min Rds On) :

10V

Factory Lead Time :

12 Weeks

Transistor Application :

SWITCHING

Drain Current-Max (Abs) (ID) :

30A

Power Dissipation :

89W

Gate Charge (Qg) (Max) @ Vgs :

33nC @ 10V

Vgs(th) (Max) @ Id :

4V @ 1mA

Rise Time :

14ns

Number of Pins :

4

JEDEC-95 Code :

MO-235

Max Dual Supply Voltage :

100V

Rds On (Max) @ Id, Vgs :

27.5m Ω @ 15A, 10V

Number of Elements :

1

Drain to Source Breakdown Voltage :

100V

RoHS Status :

ROHS3 Compliant

Terminal Finish :

Tin (Sn)

JESD-609 Code :

e3

Configuration :

SINGLE WITH BUILT-IN DIODE

Power Dissipation-Max :

89W Tc