IRLU024N
- Mfr.Part #
- IRLU024N
- Manufacturer
- Infineon Technologies
- Package / Case
- TO-251-3 Short Leads, IPak, TO-251AA
- Datasheet
- Download
- Description
- MOSFET N-CH 55V 17A I-PAK
- Stock
- 13,655
- In Stock :
- 13,655
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Single
- Surface Mount :
- No
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Packaging :
- Tube
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Rds On (Max) @ Id, Vgs :
- 65m Ω @ 10A, 10V
- Operating Mode :
- ENHANCEMENT MODE
- Configuration :
- SINGLE WITH BUILT-IN DIODE
- RoHS Status :
- Non-RoHS Compliant
- Drive Voltage (Max Rds On,Min Rds On) :
- 4V 10V
- Gate Charge (Qg) (Max) @ Vgs :
- 15nC @ 5V
- Time@Peak Reflow Temperature-Max (s) :
- 30
- JESD-609 Code :
- e0
- FET Type :
- N-Channel
- Drain-source On Resistance-Max :
- 0.08Ohm
- Power Dissipation-Max :
- 45W Tc
- Qualification Status :
- Not Qualified
- Avalanche Energy Rating (Eas) :
- 68 mJ
- Package / Case :
- TO-251-3 Short Leads, IPak, TO-251AA
- Number of Terminations :
- 3
- Vgs(th) (Max) @ Id :
- 2V @ 250μA
- Drain to Source Voltage (Vdss) :
- 55V
- Peak Reflow Temperature (Cel) :
- 245
- ECCN Code :
- EAR99
- Additional Feature :
- AVALANCHE RATED
- Transistor Application :
- SWITCHING
- DS Breakdown Voltage-Min :
- 55V
- Current - Continuous Drain (Id) @ 25°C :
- 17A Tc
- Pulsed Drain Current-Max (IDM) :
- 72A
- Mounting Type :
- Through Hole
- Transistor Element Material :
- SILICON
- JESD-30 Code :
- R-PSIP-T3
- Terminal Position :
- Single
- Series :
- HEXFET®
- Published :
- 2000
- Input Capacitance (Ciss) (Max) @ Vds :
- 480pF @ 25V
- Number of Elements :
- 1
- Operating Temperature :
- -55°C~175°C TJ
- Drain Current-Max (Abs) (ID) :
- 17A
- Vgs (Max) :
- ±16V
- Case Connection :
- DRAIN
- Datasheets
- IRLU024N

N-Channel Tube 65m Ω @ 10A, 10V ±16V 480pF @ 25V 15nC @ 5V 55V TO-251-3 Short Leads, IPak, TO-251AA
IRLU024N Description
Fifth Generation HEXFET? Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve the lowest possible on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient device for use in a wide variety of applications.
The D-PAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. The straight lead version (IRFU series) is for through-hole mounting applications. Power dissipation levels up to 1.5 watts are possible in typical surface mount applications.
IRLU024N Features
-
Logic-Level Gate Drive
-
Surface Mount (IRLR024N)
-
Straight Lead (IRLU024N)
-
Advanced Process Technology
-
Fast Switching
-
Fully Avalanche Rated
IRLU024N Applications
-
Power Management
-
Consumer Electronics
-
Portable Devices
-
Industrial
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