IRFU9024N
- Mfr.Part #
- IRFU9024N
- Manufacturer
- Infineon Technologies
- Package / Case
- TO-251-3 Short Leads, IPak, TO-251AA
- Datasheet
- Download
- Description
- MOSFET P-CH 55V 11A IPAK
- Stock
- 44,975
- In Stock :
- 44,975
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Single
- JESD-30 Code :
- R-PSIP-T3
- Vgs(th) (Max) @ Id :
- 4V @ 250µA
- Drain to Source Voltage (Vdss) :
- 55V
- JESD-609 Code :
- e0
- Avalanche Energy Rating (Eas) :
- 62 mJ
- Drain-source On Resistance-Max :
- 0.175Ohm
- FET Type :
- P-Channel
- Drain Current-Max (Abs) (ID) :
- 11A
- Input Capacitance (Ciss) (Max) @ Vds :
- 350pF @ 25V
- ECCN Code :
- EAR99
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Terminal Position :
- Single
- Pulsed Drain Current-Max (IDM) :
- 44A
- Transistor Application :
- SWITCHING
- Transistor Element Material :
- SILICON
- Package / Case :
- TO-251-3 Short Leads, IPak, TO-251AA
- Qualification Status :
- Not Qualified
- Configuration :
- SINGLE WITH BUILT-IN DIODE
- DS Breakdown Voltage-Min :
- 55V
- Drive Voltage (Max Rds On,Min Rds On) :
- 10V
- Vgs (Max) :
- ±20V
- Packaging :
- Tube
- Mounting Type :
- Through Hole
- Case Connection :
- DRAIN
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Rds On (Max) @ Id, Vgs :
- 175m Ω @ 6.6A, 10V
- Series :
- HEXFET®
- Current - Continuous Drain (Id) @ 25°C :
- 11A Tc
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Number of Elements :
- 1
- Surface Mount :
- No
- RoHS Status :
- Non-RoHS Compliant
- Published :
- 1997
- Additional Feature :
- High Reliability
- Number of Terminations :
- 3
- Operating Mode :
- ENHANCEMENT MODE
- Operating Temperature :
- -55°C~150°C TJ
- Gate Charge (Qg) (Max) @ Vgs :
- 19nC @ 10V
- Power Dissipation-Max :
- 38W Tc
- Peak Reflow Temperature (Cel) :
- 245
- Datasheets
- IRFU9024N
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P-Channel Tube 175m Ω @ 6.6A, 10V ±20V 350pF @ 25V 19nC @ 10V 55V TO-251-3 Short Leads, IPak, TO-251AA
IRFU9024N Description
International Rectifier's Fifth Generation HEXFETs use innovative processing techniques to provide ultra-low on-resistance per silicon area. This benefit, when paired with the quick switching speed and ruggedized device architecture that HEXFET Power MOSFETs are known for, gives the designer an exceptionally efficient and dependable device that can be used in a wide range of applications.
Surface mounting with vapor phase, infrared, or wave soldering processes is possible with the D-Pak. For through-hole mounting applications, the straight lead version (IRFU series) is used. In normal surface mount applications, power dissipation levels of up to 1.5 watts are conceivable.
IRFU9024N Features
-
Ultra-Low On-Resistance
-
P-Channel
-
Surface Mount (IRFR9024N)
-
Straight Lead (IRFU9024N)
-
Advanced Process Technology
-
Fast Switching
-
Fully Avalanche Rated
IRFU9024N Applications
-
Power Management
-
Consumer Electronics
-
Portable Devices
-
Industrial
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