IRFU5505
- Mfr.Part #
- IRFU5505
- Manufacturer
- Infineon Technologies
- Package / Case
- TO-251-3 Short Leads, IPak, TO-251AA
- Datasheet
- Download
- Description
- MOSFET P-CH 55V 18A IPAK
- Stock
- 11,944
- In Stock :
- 11,944
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Single
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Case Connection :
- DRAIN
- Mounting Type :
- Through Hole
- DS Breakdown Voltage-Min :
- 55V
- Operating Temperature :
- -55°C~150°C TJ
- Drive Voltage (Max Rds On,Min Rds On) :
- 10V
- Vgs(th) (Max) @ Id :
- 4V @ 250µA
- Pulsed Drain Current-Max (IDM) :
- 64A
- Avalanche Energy Rating (Eas) :
- 150 mJ
- Surface Mount :
- No
- Number of Terminations :
- 3
- Drain-source On Resistance-Max :
- 0.11Ohm
- Configuration :
- SINGLE WITH BUILT-IN DIODE
- Transistor Application :
- SWITCHING
- Drain to Source Voltage (Vdss) :
- 55V
- Series :
- HEXFET®
- Number of Elements :
- 1
- JESD-30 Code :
- R-PSIP-T3
- FET Type :
- P-Channel
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- Package / Case :
- TO-251-3 Short Leads, IPak, TO-251AA
- Gate Charge (Qg) (Max) @ Vgs :
- 32nC @ 10V
- Rds On (Max) @ Id, Vgs :
- 110m Ω @ 9.6A, 10V
- Power Dissipation-Max :
- 57W Tc
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Vgs (Max) :
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds :
- 650pF @ 25V
- Drain Current-Max (Abs) (ID) :
- 18A
- JESD-609 Code :
- e0
- Transistor Element Material :
- SILICON
- Packaging :
- Tube
- Peak Reflow Temperature (Cel) :
- 245
- Terminal Position :
- Single
- ECCN Code :
- EAR99
- Qualification Status :
- Not Qualified
- Additional Feature :
- AVALANCHE RATED, HIGH RELIABILITY, ULTRA-LOW RESISTANCE
- Current - Continuous Drain (Id) @ 25°C :
- 18A Tc
- RoHS Status :
- Non-RoHS Compliant
- Published :
- 1997
- Operating Mode :
- ENHANCEMENT MODE
- Datasheets
- IRFU5505
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P-Channel Tube 110m Ω @ 9.6A, 10V ±20V 650pF @ 25V 32nC @ 10V 55V TO-251-3 Short Leads, IPak, TO-251AA
IRFU5505 Description
International Rectifier's Fifth Generation HEXFETs use innovative processing techniques to provide ultra-low on-resistance per silicon area. This benefit, when paired with the quick switching speed and ruggedized device architecture that HEXFET Power MOSFETs are known for, gives the designer an exceptionally efficient and dependable device that can be used in a wide range of applications.
Surface mounting with vapor phase, infrared, or wave soldering processes is possible with the D-Pak. For through-hole mounting applications, the straight lead version (IRFU series) is used. In normal surface mount applications, power dissipation levels of up to 1.5 watts are conceivable.
IRFU5505 Features
-
Ultra-Low On-Resistance
-
P-Channel
-
Surface Mount (IRFR5505)
-
Straight Lead (IRFU5505)
-
Advanced Process Technology
-
Fast Switching
-
Fully Avalanche Rated
IRFU5505 Applications
-
Power Management
-
Consumer Electronics
-
Portable Devices
-
Industrial
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