IRFU5305
- Mfr.Part #
- IRFU5305
- Manufacturer
- Infineon Technologies
- Package / Case
- TO-251-3 Short Leads, IPak, TO-251AA
- Datasheet
- Download
- Description
- MOSFET P-CH 55V 31A IPAK
- Stock
- 17,793
- In Stock :
- 17,793
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Single
- Number of Terminations :
- 3
- Series :
- HEXFET®
- Operating Mode :
- ENHANCEMENT MODE
- Transistor Application :
- SWITCHING
- Drive Voltage (Max Rds On,Min Rds On) :
- 10V
- Packaging :
- Tube
- Drain to Source Voltage (Vdss) :
- 55V
- Pulsed Drain Current-Max (IDM) :
- 110A
- Drain-source On Resistance-Max :
- 0.065Ohm
- Gate Charge (Qg) (Max) @ Vgs :
- 63nC @ 10V
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Vgs (Max) :
- ±20V
- RoHS Status :
- Non-RoHS Compliant
- Qualification Status :
- Not Qualified
- Rds On (Max) @ Id, Vgs :
- 65m Ω @ 16A, 10V
- Additional Feature :
- High Reliability
- Terminal Finish :
- Tin/Lead (Sn/Pb)
- ECCN Code :
- EAR99
- FET Type :
- P-Channel
- Number of Elements :
- 1
- Terminal Position :
- Single
- JESD-30 Code :
- R-PSIP-T3
- Avalanche Energy Rating (Eas) :
- 280 mJ
- Power Dissipation-Max :
- 110W Tc
- Published :
- 2000
- Package / Case :
- TO-251-3 Short Leads, IPak, TO-251AA
- DS Breakdown Voltage-Min :
- 55V
- Input Capacitance (Ciss) (Max) @ Vds :
- 1200pF @ 25V
- JESD-609 Code :
- e0
- Operating Temperature :
- -55°C~175°C TJ
- Drain Current-Max (Abs) (ID) :
- 31A
- Case Connection :
- DRAIN
- Current - Continuous Drain (Id) @ 25°C :
- 31A Tc
- Surface Mount :
- No
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Configuration :
- SINGLE WITH BUILT-IN DIODE
- Transistor Element Material :
- SILICON
- Mounting Type :
- Through Hole
- Peak Reflow Temperature (Cel) :
- 245
- Vgs(th) (Max) @ Id :
- 4V @ 250µA
- Datasheets
- IRFU5305
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P-Channel Tube 65m Ω @ 16A, 10V ±20V 1200pF @ 25V 63nC @ 10V 55V TO-251-3 Short Leads, IPak, TO-251AA
IRFU5305 Description
International Rectifier's Fifth Generation HEXFETs use innovative processing techniques to provide ultra-low on-resistance per silicon area. This benefit, when paired with the quick switching speed and ruggedized device architecture that HEXFET? Power MOSFETs are known for, gives the designer an exceptionally efficient and dependable device that can be used in a wide range of applications.
Surface mounting with vapor phase, infrared, or wave soldering processes is possible with the D-Pak. For through-hole mounting applications, the straight lead version (IRFU series) is used. In normal surface mount applications, power dissipation levels of up to 1.5 watts are conceivable.
IRFU5305 Features
-
Ultra-Low On-Resistance
-
Surface Mount (IRFR5305)
-
Straight Lead (IRFU5305)
-
Advanced Process Technology
-
Fast Switching
-
Fully Avalanche Rated
IRFU5305 Applications
-
Power Management
-
Consumer Electronics
-
Portable Devices
-
Industrial
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