IRFU3910
- Mfr.Part #
- IRFU3910
- Manufacturer
- Infineon Technologies
- Package / Case
- TO-251-3 Short Leads, IPak, TO-251AA
- Datasheet
- Download
- Description
- MOSFET N-CH 100V 16A IPAK
- Stock
- 5,827
- In Stock :
- 5,827
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Single
- Drive Voltage (Max Rds On,Min Rds On) :
- 10V
- Current - Continuous Drain (Id) @ 25°C :
- 16A Tc
- Mounting Type :
- Through Hole
- Number of Elements :
- 1
- Peak Reflow Temperature (Cel) :
- NOT SPECIFIED
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Number of Terminations :
- 3
- Gate Charge (Qg) (Max) @ Vgs :
- 44nC @ 10V
- Drain Current-Max (Abs) (ID) :
- 16A
- Packaging :
- Tube
- Vgs(th) (Max) @ Id :
- 4V @ 250µA
- Case Connection :
- DRAIN
- Input Capacitance (Ciss) (Max) @ Vds :
- 640pF @ 25V
- Series :
- HEXFET®
- RoHS Status :
- Non-RoHS Compliant
- Drain-source On Resistance-Max :
- 0.115Ohm
- Vgs (Max) :
- ±20V
- Surface Mount :
- No
- Published :
- 1998
- Additional Feature :
- AVALANCHE RATED
- Operating Mode :
- ENHANCEMENT MODE
- Configuration :
- SINGLE WITH BUILT-IN DIODE
- Transistor Element Material :
- SILICON
- Drain to Source Voltage (Vdss) :
- 100V
- Terminal Position :
- Single
- Transistor Application :
- SWITCHING
- DS Breakdown Voltage-Min :
- 100V
- FET Type :
- N-Channel
- Avalanche Energy Rating (Eas) :
- 150 mJ
- Package / Case :
- TO-251-3 Short Leads, IPak, TO-251AA
- Rds On (Max) @ Id, Vgs :
- 115m Ω @ 10A, 10V
- Time@Peak Reflow Temperature-Max (s) :
- NOT SPECIFIED
- Operating Temperature :
- -55°C~175°C TJ
- Power Dissipation-Max :
- 79W Tc
- Pulsed Drain Current-Max (IDM) :
- 60A
- JESD-30 Code :
- R-PSIP-T3
- Datasheets
- IRFU3910
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N-Channel Tube 115m Ω @ 10A, 10V ±20V 640pF @ 25V 44nC @ 10V 100V TO-251-3 Short Leads, IPak, TO-251AA
IRFU3910 Description
International Rectifier's Fifth Generation HEXFETs use innovative processing techniques to provide the lowest on-resistance per silicon area feasible. This benefit, when paired with the quick switching speed and ruggedized device architecture that HEXFET Power MOSFETs are known for, gives the designer a highly efficient device that can be used in a wide range of applications.
Surface mounting via vapor phase, infrared, or wave soldering processes is possible with the D-PAK. For through-hole mounting applications, the straight lead version (IRFU series) is used. In normal surface mount applications, power dissipation levels of up to 1.5 watts are conceivable.
IRFU3910 Features
-
Ultra-Low On-Resistance
-
Surface Mount (IRFR3910)
-
Straight Lead (IRFU3910)
-
Advanced Process Technology
-
Fast Switching
-
Fully Avalanche Rated
IRFU3910 Applications
-
Power Management
-
Consumer Electronics
-
Portable Devices
-
Industrial
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