IRF7907TRPBF
- Mfr.Part #
- IRF7907TRPBF
- Manufacturer
- Infineon Technologies
- Package / Case
- 8-SOIC (0.154, 3.90mm Width)
- Datasheet
- Download
- Description
- MOSFET 2N-CH 30V 9.1A/11A 8SO
- Stock
- 8,461
- In Stock :
- 8,461
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Arrays
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- Vgs(th) (Max) @ Id :
- 2.35V @ 25µA
- Published :
- 2008
- RoHS Status :
- ROHS3 Compliant
- Factory Lead Time :
- 12 Weeks
- ECCN Code :
- EAR99
- Gate Charge (Qg) (Max) @ Vgs :
- 10nC @ 4.5V
- Terminal Finish :
- Matte Tin (Sn)
- Power Dissipation :
- 2W
- Lead Free :
- Lead Free
- Base Part Number :
- IRF7907PBF
- Current - Continuous Drain (Id) @ 25°C :
- 9.1A 11A
- Input Capacitance (Ciss) (Max) @ Vds :
- 850pF @ 15V
- Element Configuration :
- Dual
- Gate to Source Voltage (Vgs) :
- 20V
- FET Type :
- 2 N-Channel (Dual)
- Terminal Form :
- Gull wing
- FET Technology :
- METAL-OXIDE SEMICONDUCTOR
- Number of Terminations :
- 8
- Continuous Drain Current (ID) :
- 11A
- Mounting Type :
- Surface Mount
- Package / Case :
- 8-SOIC (0.154, 3.90mm Width)
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Number of Elements :
- 2
- Length :
- 4.9784mm
- Avalanche Energy Rating (Eas) :
- 15 mJ
- Peak Reflow Temperature (Cel) :
- 260
- Operating Mode :
- ENHANCEMENT MODE
- Transistor Element Material :
- SILICON
- Number of Pins :
- 8
- Drain to Source Breakdown Voltage :
- 30V
- Series :
- HEXFET®
- JESD-609 Code :
- e3
- Height :
- 1.4986mm
- Mount :
- Surface Mount
- Radiation Hardening :
- No
- Max Power Dissipation :
- 2W
- Rds On (Max) @ Id, Vgs :
- 16.4m Ω @ 9.1A, 10V
- Width :
- 3.9878mm
- FET Feature :
- Logic Level Gate
- Packaging :
- Tape and Reel (TR)
- Operating Temperature :
- -55°C~150°C TJ
- Datasheets
- IRF7907TRPBF

IRF7907TRPBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available at
IRF7907TRPBF Description
These HEXFET power MOSFET are designed for automotive applications and are packaged in dual SO-8 packages that use the latest technology to achieve extremely low on-resistance per silicon area. Other features of these automotive certified HEXFET power MOSFET include 150 °C junction operating temperature, fast switching speed and improved repeated avalanche ratings. The combination of these advantages makes the design an extremely efficient and reliable device for automotive and a variety of other applications. The efficient SO-8 package provides enhanced thermal characteristics and dual MOSFET die capabilities, making it an ideal choice for a variety of power applications. This dual surface mount SO-8 can greatly reduce circuit board space, and can also be used in magnetic tapes and reels.
IRF7907TRPBF Features
· Advanced Planar Technology
· Ultra Low On-Resistance
· Logic Level Gate Drive
· Dual N and P Channel MOSFET
· Surface Mount
· Available in Tape & Reel
· 150°C Operating Temperature
· Lead-Free, RoHS Compliant
· Automotive Qualified
IRF7907TRPBF Applications
The combination of these advantages makes the design an extremely efficient and reliable device for automotive and a variety of other applications.
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