IRF7751
- Mfr.Part #
- IRF7751
- Manufacturer
- Infineon Technologies
- Package / Case
- 8-TSSOP (0.173, 4.40mm Width)
- Datasheet
- Download
- Description
- MOSFET 2P-CH 30V 4.5A 8-TSSOP
- Stock
- 8,437
- In Stock :
- 8,437
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- Manufacturer :
- Infineon Technologies
- Product Category :
- Transistors - FETs, MOSFETs - Arrays
- Gate Charge (Qg) (Max) @ Vgs :
- 44nC @ 10V
- Mounting Type :
- Surface Mount
- Voltage - Rated DC :
- -30V
- Operating Mode :
- ENHANCEMENT MODE
- Lead Free :
- Contains Lead
- Drain-source On Resistance-Max :
- 0.035Ohm
- ECCN Code :
- EAR99
- Published :
- 2007
- Drain to Source Breakdown Voltage :
- -30V
- Operating Temperature :
- -55°C~150°C TJ
- FET Feature :
- Logic Level Gate
- Peak Reflow Temperature (Cel) :
- 260
- Input Capacitance (Ciss) (Max) @ Vds :
- 1464pF @ 25V
- Series :
- HEXFET®
- Terminal Form :
- Gull wing
- Number of Elements :
- 2
- JEDEC-95 Code :
- MO-153AA
- Mount :
- Surface Mount
- Terminal Finish :
- MATTE TIN
- Continuous Drain Current (ID) :
- 4.5A
- Current Rating :
- -4.5A
- Additional Feature :
- High Reliability
- Configuration :
- SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
- FET Type :
- 2 P-Channel (Dual)
- Vgs(th) (Max) @ Id :
- 2.5V @ 250μA
- Drain to Source Voltage (Vdss) :
- 30V
- RoHS Status :
- Non-RoHS Compliant
- Qualification Status :
- Not Qualified
- Time@Peak Reflow Temperature-Max (s) :
- 30
- Moisture Sensitivity Level (MSL) :
- 1 (Unlimited)
- JESD-609 Code :
- e3
- Transistor Element Material :
- SILICON
- FET Technology :
- METAL-OXIDE SEMICONDUCTOR
- Rds On (Max) @ Id, Vgs :
- 35m Ω @ 4.5A, 10V
- Number of Terminations :
- 8
- Package / Case :
- 8-TSSOP (0.173, 4.40mm Width)
- JESD-30 Code :
- R-PDSO-G8
- Packaging :
- Tube
- Transistor Application :
- SWITCHING
- Max Power Dissipation :
- 1W
- Datasheets
- IRF7751
IRF7751 datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available at
IRF7751 Description
International Rectifier's HEXFET Power MOSFET uses advanced technology to achieve extremely low on-resistance per silicon area. This advantage, combined with the well-known rugged equipment design of International Rectifier, provides designers with extremely efficient and reliable equipment for battery and load management. Compared with the standard SO-8, the footprint of the TSSOP-8 package is reduced by 45%. This makes the TSSOP-8 an ideal device for space-constrained applications on printed circuit boards. The ultra-thin shape (< 1.2mm) makes it easy to install in extremely thin environments, such as portable electronics and PCMCIA cards.
IRF7751 Features
Ultra Low On-Resistance
Dual P-Channel MOSFET
Very Small SOIC Package
Low Profile (< 1.2mm)
Available in Tape & Reel
IRF7751 Applications
provides designers with extremely efficient and reliable equipment for battery and load management
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